Temperature dependence of contact resistance of Au−Ti−Pd2Si−n+-Si ohmic contacts

Article Properties
Cite
Belyaev, A. Ye. “Temperature Dependence of Contact Resistance of Au−Ti−Pd2Si−n+-Si Ohmic Contacts”. Semiconductor Physics, Quantum Electronics and Optoelectronics, vol. 13, no. 4, 2010, pp. 436-8, https://doi.org/10.15407/spqeo13.04.436.
Belyaev, A. Y. (2010). Temperature dependence of contact resistance of Au−Ti−Pd2Si−n+-Si ohmic contacts. Semiconductor Physics, Quantum Electronics and Optoelectronics, 13(4), 436-438. https://doi.org/10.15407/spqeo13.04.436
Belyaev AY. Temperature dependence of contact resistance of Au−Ti−Pd2Si−n+-Si ohmic contacts. Semiconductor Physics, Quantum Electronics and Optoelectronics. 2010;13(4):436-8.
Journal Category
Science
Physics
Refrences
Title Journal Journal Categories Citations Publication Date
Electronic states and atomic structure at the Pd2Si–Si interface

Journal of Vacuum Science and Technology 48 1981
10.1134/S1063782608110134
10.1134/S1063782607110012
Peculiarities in the mechanism of current flow through an ohmic contact to gallium phosphide Technical Physics Letters
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  • Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials
  • Science: Physics
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7. V.M. Ievlev, S.B. Kushev, A.V. Bugakov, S.A. Soldatenko, B.N. Markushev, I.G. Rudneva, Conjugation regularities and substructure of interphase boundaries in the Si−Me silicide systems (Me: Pt, Pd, Ni, Re, Ir, Mo, Ti) // Proc. ISFTE-12, Kharkov, Ukraine, 2002, p. 201-206.
Citations
Title Journal Journal Categories Citations Publication Date
Features of the Temperature Dependence of the Specific Contact Resistance of Au–Ti–Pd–n+–n-Si Diffusion Silicon Structures Semiconductors
  • Technology: Chemical technology
  • Science: Physics
  • Technology: Chemical technology
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials
  • Science: Physics
2019
Application of nanostructured silver film in multilayer contact system of Ti/Mo/Ag silicon photoconverters Radioelectronics and Communications Systems 2016
Current flow through metal shunts in ohmic contacts to n +-Si Semiconductors
  • Technology: Chemical technology
  • Science: Physics
  • Technology: Chemical technology
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials
  • Science: Physics
2014
On a feature of temperature dependence of contact resistivity for ohmic contacts to n-Si with an n + -n doping step Semiconductor Physics, Quantum Electronics and Optoelectronics
  • Science: Physics
  • Science: Physics
2 2014
The mechanism of contact-resistance formation on lapped n-Si surfaces Semiconductors
  • Technology: Chemical technology
  • Science: Physics
  • Technology: Chemical technology
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials
  • Science: Physics
2013
Citations Analysis
The category Science: Physics 7 is the most commonly referenced area in studies that cite this article. The first research to cite this article was titled Features of temperature dependence of contact resistivity in ohmic contacts on lapped n-Si and was published in 2012. The most recent citation comes from a 2019 study titled Features of the Temperature Dependence of the Specific Contact Resistance of Au–Ti–Pd–n+–n-Si Diffusion Silicon Structures. This article reached its peak citation in 2014, with 2 citations. It has been cited in 4 different journals, 25% of which are open access. Among related journals, the Semiconductors cited this research the most, with 4 citations. The chart below illustrates the annual citation trends for this article.
Citations used this article by year