Cyclic deformation of polycrystalline Cu films

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Cite
Schwaiger, R., et al. “Cyclic Deformation of Polycrystalline Cu Films”. Philosophical Magazine, vol. 83, no. 6, 2003, pp. 693-10, https://doi.org/10.1080/0141861021000056690.
Schwaiger, R., Dehm, G., & Kraft, O. (2003). Cyclic deformation of polycrystalline Cu films. Philosophical Magazine, 83(6), 693-710. https://doi.org/10.1080/0141861021000056690
Schwaiger, R., G. Dehm, and O. Kraft. “Cyclic Deformation of Polycrystalline Cu Films”. Philosophical Magazine 83, no. 6 (2003): 693-710. https://doi.org/10.1080/0141861021000056690.
1.
Schwaiger R, Dehm G, Kraft O. Cyclic deformation of polycrystalline Cu films. Philosophical Magazine. 2003;83(6):693-710.
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Materials of engineering and construction
Mechanics of materials
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Metallurgy
Refrences
Title Journal Journal Categories Citations Publication Date
Fatigue behavior of polycrystalline thin copper films Zeitschrift für Metallkunde 61 2002
The temperature dependence of the saturation stress and dislocation substructure in fatigued copper single crystals Acta Metallurgica 169 1980
Studies on the Structure Developed around Fatigue Cracks of Aluminium Using a High Voltage Electron Microscope Transactions of the Japan Institute of Metals 15 1974
Studies on the Structure Developed around Fatigue Cracks of Aluminium Using a High Voltage Electron Microscope 1973
Studies on the Structure Developed around Fatigue Cracks of Aluminium Using a High Voltage Electron Microscope 1965
Citations
Title Journal Journal Categories Citations Publication Date
Effect of Ag agglomeration-driven nanovoids formation on fatigue reliability of Cu–Ag alloy flexible interconnects Journal of Materials Research and Technology
  • Technology: Mining engineering. Metallurgy
  • Science: Chemistry
  • Technology: Mining engineering. Metallurgy
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials
  • Technology: Chemical technology
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials
 2024
Effect of Ag agglomeration-driven nanovoids formation on fatigue reliability of Cu–Ag alloy flexible interconnects Journal of Materials Research and Technology
  • Technology: Mining engineering. Metallurgy
  • Science: Chemistry
  • Technology: Mining engineering. Metallurgy
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials
  • Technology: Chemical technology
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials
 2024
Size effects in fatigue crack growth in confined volumes: A microbending case study on nanocrystalline nickel Materials & Design
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials
  • Science: Chemistry
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials
 2024
The effects of interlayer size and crystallinity on fatigue behavior of Cu/X (X= cr, amorphous CuZr) bilayers Materials Science and Engineering: A
  • Technology: Chemical technology
  • Science: Chemistry
  • Technology: Mining engineering. Metallurgy
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials
  • Technology: Chemical technology
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials
 2024
Vertical Pattern of Interconnects to Bypass High Strain Near a Hard Die on a Flexible Substrate Under Mechanical Bending Electronic Materials Letters
  • Science: Chemistry
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials
 1 2023
Citations Analysis
Category Category Repetition
Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials82
Science: Chemistry76
Technology: Chemical technology74
Technology: Mining engineering. Metallurgy39
Science: Physics37
Technology: Electrical engineering. Electronics. Nuclear engineering: Electric apparatus and materials. Electric circuits. Electric networks12
Science: Chemistry: Physical and theoretical chemistry11
Technology: Mechanical engineering and machinery8
Technology: Engineering (General). Civil engineering (General)8
Technology: Engineering (General). Civil engineering (General): Mechanics of engineering. Applied mechanics7
Technology: Electrical engineering. Electronics. Nuclear engineering: Electronics7
Science: Chemistry: General. Including alchemy4
Science: Mathematics: Instruments and machines3
Science: Physics: Optics. Light2
Science: Science (General)1
Science: Physics: Acoustics. Sound1
Medicine: Medicine (General): Medical physics. Medical radiology. Nuclear medicine1
Medicine: Medicine (General)1
Technology: Manufactures1
Technology: Chemical technology: Biotechnology1
The category Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials 82 is the most commonly referenced area in studies that cite this article. The first research to cite this article was titled Effect of film thickness and grain size on fatigue-induced dislocation structures in Cu thin films and was published in 2003. The most recent citation comes from a 2024 study titled Size effects in fatigue crack growth in confined volumes: A microbending case study on nanocrystalline nickel. This article reached its peak citation in 2016, with 10 citations. It has been cited in 60 different journals, 10% of which are open access. Among related journals, the Materials Science and Engineering: A cited this research the most, with 15 citations. The chart below illustrates the annual citation trends for this article.
Citations used this article by year