Fatigue behavior of polycrystalline thin copper films
Article Properties
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LanguageEnglish
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DOI (url)
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Publication Date2002/05/01
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Journal
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Indian UGC (journal)
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Refrences26
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Citations61
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O. Kraft
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P. Wellner
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M. Hommel
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R. Schwaiger
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E. Arzt
Cite
Kraft, O., et al. “Fatigue Behavior of Polycrystalline Thin Copper Films”. Zeitschrift für Metallkunde, vol. 93, no. 5, 2002, pp. 392-00, https://doi.org/10.3139/146.020392.
Kraft, O., Wellner, P., Hommel, M., Schwaiger, R., & Arzt, E. (2002). Fatigue behavior of polycrystalline thin copper films. Zeitschrift für Metallkunde, 93(5), 392-400. https://doi.org/10.3139/146.020392
Kraft, O., P. Wellner, M. Hommel, R. Schwaiger, and E. Arzt. “Fatigue Behavior of Polycrystalline Thin Copper Films”. Zeitschrift für Metallkunde 93, no. 5 (2002): 392-400. https://doi.org/10.3139/146.020392.
Kraft O, Wellner P, Hommel M, Schwaiger R, Arzt E. Fatigue behavior of polycrystalline thin copper films. Zeitschrift für Metallkunde. 2002;93(5):392-400.
Refrences
| Title | Journal | Journal Categories | Citations | Publication Date |
|---|---|---|---|---|
| Title | 1954 | |||
| Deformation Mechanism Maps: The Plasticity and Creep of Metals and Ceramics | 1982 | |||
| National Advisory Comission on Aeronautics | 1954 | |||
Fatigue of Microlithographically-Patterned Free-Standing Aluminum Thin Film Under Axial Stresses | Journal of Electronic Packaging |
| 26 | 1995 |
| 10.1557/JMR.2000.0177 |
Citations
| Title | Journal | Journal Categories | Citations | Publication Date |
|---|---|---|---|---|
| A multi-scale model of film/substrate interface damage due to the evolution of vacancy concentration inside the film | Mechanics of Advanced Materials and Structures |
| 3 | 2022 |
Materials Engineering for Flexible Metallic Thin Film Applications | Materials |
| 29 | 2022 |
| Achieving very high cycle fatigue performance of Au thin films for flexible electronic applications | Journal of Materials Science & Technology |
| 7 | 2021 |
| In-situ revealing the degradation mechanisms of Pt film over 1000 °C | Journal of Materials Science & Technology |
| 8 | 2021 |
| Quantitative analysis of void initiation in thermo-mechanical fatigue of polycrystalline copper films | Microelectronics Reliability |
| 5 | 2021 |
Citations Analysis
The category
Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials 40
is the most commonly referenced area in studies that cite this article. The first research to cite this article was titled Dislocation dynamics in sub-micron confinement: recent progress in Cu thin film plasticity and was published in 2002. The most recent citation comes from a 2022 study titled A multi-scale model of film/substrate interface damage due to the evolution of vacancy concentration inside the film. This article reached its peak citation in 2021, with 5 citations. It has been cited in 34 different journals, 11% of which are open access. Among related journals, the Materials Science and Engineering: A cited this research the most, with 8 citations. The chart below illustrates the annual citation trends for this article.