Review on flexible photonics/electronics integrated devices and fabrication strategy
Article Properties
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LanguageEnglish
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DOI (url)
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Publication Date2018/05/15
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Indian UGC (journal)
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Refrences140
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Citations67
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Shisheng Cai
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Zhiyuan Han
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Fengle Wang
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Kunwei Zheng
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Yu Cao
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Yinji Ma
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Xue Feng
Cite
Cai, Shisheng, et al. “Review on Flexible Photonics Electronics Integrated Devices and Fabrication Strategy”. Science China Information Sciences, vol. 61, no. 6, 2018, https://doi.org/10.1007/s11432-018-9442-3.
Cai, S., Han, Z., Wang, F., Zheng, K., Cao, Y., Ma, Y., & Feng, X. (2018). Review on flexible photonics/electronics integrated devices and fabrication strategy. Science China Information Sciences, 61(6). https://doi.org/10.1007/s11432-018-9442-3
Cai, Shisheng, Zhiyuan Han, Fengle Wang, Kunwei Zheng, Yu Cao, Yinji Ma, and Xue Feng. “Review on Flexible Photonics Electronics Integrated Devices and Fabrication Strategy”. Science China Information Sciences 61, no. 6 (2018). https://doi.org/10.1007/s11432-018-9442-3.
1.
Cai S, Han Z, Wang F, Zheng K, Cao Y, Ma Y, et al. Review on flexible photonics/electronics integrated devices and fabrication strategy. Science China Information Sciences. 2018;61(6).
Journal Categories
Science
Mathematics
Instruments and machines
Electronic computers
Computer science
Science
Mathematics
Instruments and machines
Electronic computers
Computer science
Computer software
Science
Science (General)
Cybernetics
Information theory
Technology
Electrical engineering
Electronics
Nuclear engineering
Electric apparatus and materials
Electric circuits
Electric networks
Technology
Electrical engineering
Electronics
Nuclear engineering
Electronics
Computer engineering
Computer hardware
Refrences
| Title | Journal | Journal Categories | Citations | Publication Date |
|---|---|---|---|---|
| Flexible Near-Field Wireless Optoelectronics as Subdermal Implants for Broad Applications in Optogenetics | Neuron |
| 265 | 2017 |
| Solution-processed organic–inorganic hybrid CMOS inverter exhibiting a high gain reaching 890 | Organic Electronics |
| 15 | 2017 |
| Solvent driven performance in thin floating-films of PBTTT for organic field effect transistor: Role of macroscopic orientation | Organic Electronics |
| 55 | 2017 |
Designing Thin, Ultrastretchable Electronics with Stacked Circuits and Elastomeric Encapsulation Materials | Advanced Functional Materials |
| 40 | 2017 |
| 10.1039/C7LC00289K | Lab on a Chip |
| 2017 |
Refrences Analysis
The category
Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials 116
is the most frequently represented among the references in this article. It primarily includes studies from Advanced Materials and Nature Communications. The chart below illustrates the number of referenced publications per year.
Refrences used by this article by year
Citations
| Title | Journal | Journal Categories | Citations | Publication Date |
|---|---|---|---|---|
Flexible Supercapacitor Integrated Systems | Advanced Materials Technologies |
| 2024 | |
| Experimental analysis of a heat pipe-assisted flexible heat transfer device | Heat and Mass Transfer |
| 2024 | |
| Experimental analysis and simulation of passive flexible heat transfer device | International Journal of Thermal Sciences |
| 1 | 2024 |
| Review of bioresource-based conductive composites for portable flexible electronic devices | Renewable and Sustainable Energy Reviews |
| 1 | 2024 |
| Wafer-Recyclable, Eco-Friendly, and Multiscale Dry Transfer Printing by Transferable Photoresist for Flexible Epidermal Electronics | ACS Applied Materials & Interfaces |
| 2024 |
Citations Analysis
The category
Science: Chemistry 42
is the most commonly referenced area in studies that cite this article. The first research to cite this article was titled Anti-self-collapse design of reservoir in flexible epidermal microfluidic device via pillar supporting and was published in 2018. The most recent citation comes from a 2024 study titled Experimental analysis of a heat pipe-assisted flexible heat transfer device. This article reached its peak citation in 2020, with 20 citations. It has been cited in 46 different journals, 17% of which are open access. Among related journals, the ACS Applied Materials & Interfaces cited this research the most, with 5 citations. The chart below illustrates the annual citation trends for this article.