Experimental analysis and simulation of passive flexible heat transfer device

Article Properties
Cite
Pandi, Kannan, et al. “Experimental Analysis and Simulation of Passive Flexible Heat Transfer Device”. International Journal of Thermal Sciences, vol. 199, 2024, p. 108902, https://doi.org/10.1016/j.ijthermalsci.2024.108902.
Pandi, K., Jaganathan, V., Suresh, S., & S.R., A. K. (2024). Experimental analysis and simulation of passive flexible heat transfer device. International Journal of Thermal Sciences, 199, 108902. https://doi.org/10.1016/j.ijthermalsci.2024.108902
Pandi, Kannan, V.M. Jaganathan, S. Suresh, and Akhil Krishnan S.R. “Experimental Analysis and Simulation of Passive Flexible Heat Transfer Device”. International Journal of Thermal Sciences 199 (2024): 108902. https://doi.org/10.1016/j.ijthermalsci.2024.108902.
Pandi K, Jaganathan V, Suresh S, S.R. AK. Experimental analysis and simulation of passive flexible heat transfer device. International Journal of Thermal Sciences. 2024;199:108902.
Refrences
Title Journal Journal Categories Citations Publication Date
Effect of phase change temperatures and orientation on the thermal performance of a miniaturized PCM heat sink coupled heat pipe Experimental Heat Transfer
  • Science: Physics: Heat: Thermodynamics
  • Technology: Mechanical engineering and machinery
  • Technology: Engineering (General). Civil engineering (General)
12 2023
Numerical development of EHD cooling systems for laptop applications Applied Thermal Engineering
  • Science: Physics: Heat: Thermodynamics
  • Social Sciences: Industries. Land use. Labor: Special industries and trades: Energy industries. Energy policy. Fuel trade
  • Technology: Mechanical engineering and machinery
  • Technology: Engineering (General). Civil engineering (General): Mechanics of engineering. Applied mechanics
  • Technology: Mechanical engineering and machinery
  • Technology: Engineering (General). Civil engineering (General)
42 2018
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  • Science: Physics: Heat: Thermodynamics
  • Technology: Mechanical engineering and machinery
  • Science: Physics: Electricity and magnetism: Electricity: Plasma physics. Ionized gases
  • Technology: Mechanical engineering and machinery
  • Technology: Engineering (General). Civil engineering (General)
71 2018
Review on flexible photonics/electronics integrated devices and fabrication strategy Science China Information Sciences
  • Science: Science (General): Cybernetics: Information theory
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Electric apparatus and materials. Electric circuits. Electric networks
  • Science: Mathematics: Instruments and machines: Electronic computers. Computer science: Computer software
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Electronics: Computer engineering. Computer hardware
  • Science: Mathematics: Instruments and machines: Electronic computers. Computer science
67 2018
Thermal conductance characterization of a pressed copper rope strap between 0.13 K and 10 K Cryogenics
  • Science: Physics: Heat: Thermodynamics
  • Science: Physics
  • Technology: Mechanical engineering and machinery
  • Technology: Chemical technology
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials
  • Science: Physics
9 2017
Citations
Title Journal Journal Categories Citations Publication Date
Improvement in Laptop Heat Dissipation with Taguchi Method

Electronics
  • Science: Science (General): Cybernetics: Information theory
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Electric apparatus and materials. Electric circuits. Electric networks
  • Science: Physics
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Electronics
  • Technology: Engineering (General). Civil engineering (General)
2024
Citations Analysis
The category Science: Science (General): Cybernetics: Information theory 1 is the most commonly referenced area in studies that cite this article. The first research to cite this article was titled Improvement in Laptop Heat Dissipation with Taguchi Method and was published in 2024. The most recent citation comes from a 2024 study titled Improvement in Laptop Heat Dissipation with Taguchi Method. This article reached its peak citation in 2024, with 1 citations. It has been cited in 1 different journals. Among related journals, the Electronics cited this research the most, with 1 citations. The chart below illustrates the annual citation trends for this article.
Citations used this article by year