Journal of Electronics Manufacturing

Title Publication Date Language Citations
Keyword Index for 19931993/12/01English
EDITORIAL1994/12/01English
EDITORIAL2000/12/01English
EDITORIAL1995/03/01English
EDITORIAL1997/12/01English
AUTHOR INDEX VOLUME 10 (2000)2000/12/01English
ESTIMATING THE PRODUCTION TIMES IN PCB ASSEMBLY2002/06/01English
An intelligent decision support environment for PCB assembly1994/06/01English
Thermal analysis of IC packages and printed circuit boards1994/12/01English
Tolerance analysis and synthesis across assemblies: state-of-the-art review1994/03/01English
A low-cost automated handling system for SPC evaluation of packaging processes1994/06/01English
A fuzzy management decision support system for scenario analysis1994/03/01English
Workshop Report: "The EPSRC/D & IPG Electronics Assembly Sector Workshop"1994/06/01English
What are the design and manufacturing couplings for electronics products?1994/06/01English
Computer simulation of solder paste flow Part I: Dense suspension theory1994/09/01English
The significance of desoldering and resoldering methods in robotic automated rework1994/03/01English
The use of electronic speckle pattern interferometry in electronics manufacturing process modelling1994/03/01English
MODELING OF MATERIAL HANDLING HOIST OPERATIONS IN A PCB MANUFACTURING FACILITY2002/03/01English
Book Review: "Green Electronics/Green Bottom Line: Environmentally Responsible Engineering", Lee H. Goldberg (Editor), Wendy Middleton (Assistant Editor)1999/03/01English
Asia’s manufacturing industry gearing up for the high-value electronics market1994/12/01English
PCB defect trends associated with the use of a no-clean flux and varying concentrations of oxygen in the wave soldering process atmosphere1994/09/01English
Analysing the strategic implications of interconnect technologies1994/09/01English
Postponement of packaging and product differentiation for lower logistics costs1994/06/01English
Particle identification system for semiconductor manufacturing1994/03/01English
Computer simulation of solder paste flow Part II: Flow out of a stencil aperture1994/09/01English
Book Review: "Electronic Displays"1994/09/01English
Singapore: strategic thrusts for competitive success in the electronics industry1994/12/01English
Portable communications: trends in systems and component technology1994/12/01English
Advanced superfine-pitch technology1994/12/01English
Solder paste for tomorrow’s electronics manufacturing technology1994/12/01English