Journal of Electronics Manufacturing

Title Publication Date Language Citations
Wire bond parameter optimization study1994/12/01English
Component procurement under demand uncertainty for mainframe subassemblies1994/03/01English
Submit Report: Pan Asian Electronic Business '941994/12/01English
CPS: a productivity tool for component placement in multi-head concurrent operation PCBA machines1994/06/01English
IBM Microelectronics’ multilayer ceramic packaging plant: a transformation from internal supplier to a market-driven OEM supplier1994/09/01English
The current status and future of electronics manufacturing in Penang1994/12/01English
A MULTI-CRITERIA DECISION MAKING APPROACH FOR DISASSEMBLY-TO-ORDER SYSTEMS2002/06/01English
METHOD FOR FORMULATING PRODUCT END-OF-LIFE STRATEGIES FOR ELECTRONICS INDUSTRY2002/06/01English
A MULTI-EXCHANGE NEIGHBORHOOD SEARCH HEURISTIC FOR AN INTEGRATED CLUSTERING AND MACHINE SETUP MODEL FOR PCB MANUFACTURING2002/06/01English
DEMAND-DRIVEN DISASSEMBLY OPTIMIZATION FOR ELECTRONIC PRODUCTS PACKAGE RELIABILITY2002/06/01English
ELECTROMAGNETIC WAVE TRANSMISSION THROUGH LOSSLESS ELECTRICALLY CONDUCTIVE ADHESIVE1999/12/01English
CONTROL OF INCIPIENCE HYSTERESIS EFFECTS IN LIQUID COOLED ELECTRONICS HEAT SINKS1999/06/01English
ENHANCED JET IMPINGEMENT HEAT TRANSFER WITH CROSSFLOW AT LOW REYNOLDS NUMBERS1999/06/01English
INVESTIGATIVE STUDY OF MANIFOLD MICROCHANNEL HEAT SINKS FOR ELECTRONIC COOLING DESIGN1999/06/01English
DESIGN, MANUFACTURING, AND TESTING OF A NOVEL PLASTIC BALL GRID ARRAY PACKAGE1999/12/01English
THE "GREEN DESIGN ADVISOR": A TOOL FOR DESIGN FOR ENVIRONMENT1999/03/01English
THERMAL DESIGN OF HIGH POWER SEMICONDUCTOR PACKAGES FOR AIRCRAFT SYSTEMS1999/12/01English
ELECTRONIC PRODUCTS AT THEIR END-OF-LIFE: OPTIONS AND OBSTACLES1999/03/01English
MULTI-LIFECYCLE PRODUCT RECOVERY FOR ELECTRONIC PRODUCTS1999/03/01English
INTELLIGENT SIMULATION ENVIRONMENT FOR PRINTED CIRCUIT BOARD ASSEMBLY1999/12/01English
ASSEMBLY OF LARGE PBGAS ON PRINTED CIRCUIT BOARD WITH LARGE PQFPS DIRECTLY ON THE OPPOSITE SIDE1999/12/01English
COMPUTER TAKE-BACK AND RECYCLING: AN ECONOMIC ANALYSIS FOR USED CONSUMER EQUIPMENT1999/03/01English
PROPERTIES OF CONDUCTIVE ADHESIVES BASED ON DIFFERENT CURING AGENTS1999/12/01English
A FRAMEWORK FOR THE FLEXIBLE GROUPING OF PRODUCTS FOR DISASSEMBLY1999/03/01English
ANALYSIS OF DESIGN EFFICIENCY FOR THE DISASSEMBLY OF MODULAR ELECTRONIC PRODUCTS1999/03/01English
PRODUCT END-OF-LIFE STRATEGY CATEGORIZATION DESIGN TOOL1999/03/01English
A DESIGN FOR MANUFACTURE KNOWLEDGE-BASED SYSTEM IN PRINTED BOARD ASSEMBLY PRODUCTION FOR NORTHERN TELECOM (NORTHERN IRELAND LTD.)1995/03/01English
CHINA ELECTRONICS INDUSTRY FORUM, SHENZHEN, CHINA, 19–21 APRIL 19951995/09/01English
DURABILITY OF ANISOTROPICALLY CONDUCTIVE ADHESIVE JOINTS IN SURFACE MOUNT APPLICATIONS AND IN FLEXIBLE TO RIGID BOARD INTERCONNECTION1995/12/01English
FLIP-CHIP INTERCONNECTION TO VARIOUS SUBSTRATES USING ANISOTROPIC CONDUCTIVE ADHESIVE FILMS1995/12/01English