Journal of Electronics Manufacturing

Title Publication Date Language Citations
MICRO-APPLICATION OF NON-FILLED ADHESIVES FOR PRECISION ASSEMBLY IN MICROSYSTEMS MANUFACTURING1996/09/01English
AUTOMATIC PROCESS PLANNING SYSTEM FOR THE MANUFACTURE OF UNPOPULATED PRINTED CIRCUIT BOARDS1996/09/01English
THE PERFORMANCE OF VIBRATING SQUEEGEE IN THE STENCIL PRINTING OF SOLDER PASTES1996/12/01English
CONFERENCE REPORT ON THE 1995 JAPAN INTERNATIONAL ELECTRONIC MANUFACTURING TECHNOLOGY SYMPOSIUM1996/03/01English
THERMAL DISSIPATION CHARACTERISTICS OF A TAPE AUTOMATED BONDING ELECTRONIC PACKAGE1996/06/01English
INTEGRATED NEURAL NETWORK MODELING FOR ELECTRONIC MANUFACTURING1996/06/01English
SMT FEEDER SLOT ASSIGNMENT FOR PREDETERMINED COMPONENT PLACEMENT PATHS1996/09/01English
PARAMETER INTERACTIONS IN STENCIL PRINTING OF SOLDER PASTE1996/12/01English
PARAMETRIC STUDIES OF MICROCHANNEL CONJUGATE LIQUID FLOWS WITH ZETA POTENTIAL EFFECTS2000/12/01English
COMPONENT TO MULTI-TRACK FEEDER ASSIGNMENT AND BOARD SEQUENCING IN PRINTED CIRCUIT BOARD ASSEMBLY2002/03/01English
DIRECT IMMERSION COOLED MICROELECTRONICS HEAT SINKS: EFFECTS OF TEST FLUID AND BONDING TECHNIQUE2000/12/01English
STATISTICAL OPTIMISATION OF THERMOPLASTIC INJECTION MOULDING PROCESS FOR THE ENCAPSULATION OF ELECTRONIC SUBASSEMBLY2000/09/01English
STUDY ON PROPERTY OF UNDERFILL BASED ON EPOXY CURED WITH ACID ANHYDRIDE FOR FLIP CHIP APPLICATION2000/09/01English
UNDER BUMP METALLISATION OF FINE PITCH FLIP-CHIP USING ELECTROLESS NICKEL DEPOSITION2000/09/01English
DESIGN CONSIDERATIONS OF HIGH HEAT FLUX HEAT PIPE EVAPORATORS2000/12/01English
TURBULENT FLOW AND HEAT TRANSFER OVER HEATED MODULES FOR A WIDE RANGE OF REYNOLDS NUMBERS AND MODULE SIZE2000/12/01English
TURBULENT FLUID FLOWS AND HEAT TRANSFER CHARACTERISTICS IN FLOW CHANNELS WITH DISTRIBUTED CHIP MODULES1999/06/01English
ANALYSIS AND EXPERIMENTS OF BALL DEFORMATION FOR ULTRA-FINE-PITCH WIRE BONDING2000/12/01English
THERMAL STRATEGY FOR MODELING THE WIREBONDED PBGA PACKAGES1999/06/01English
MOISTURE ABSORPTION BY ENCAPSULATED MICROCHIP PACKAGES2000/09/01English
EDITORIAL1999/06/01English
NEURAL NETWORK OPEN LOOP CONTROL SYSTEM FOR WAVE SOLDERING2002/03/01English
THERMAL WAKE EFFECTS IN PRINTED CIRCUIT BOARDS1999/06/01English
STEADY STATE AND TRANSIENT THERMAL ANALYSIS OF CHIP SCALE PACKAGES1999/06/01English
SCHEDULING OF PRINTED WIRING BOARD ASSEMBLY IN SURFACE MOUNT TECHNOLOGY LINES2002/03/01English
THE IMPACTS OF VARIABILITY ON SCHEDULING APPROACHES FOR A PRINTED WIRING BOARD ASSEMBLY OPERATION2002/03/01English
MODELS TO ESTIMATE PRINTED CIRCUIT BOARD FABRICATION YIELD DURING THE DESIGN STAGE1999/09/01English
ANALYTICAL FORCED CONVECTION MODELING OF PLATE FIN HEAT SINKS2000/12/01English
ECONOMIC SENSITIVITY FOR END OF LIFE PLANNING AND PROCESSING OF PERSONAL COMPUTERS2002/03/01English
NUMERICAL SIMULATION OF FLOW AND CONJUGATE HEAT TRANSFER IN A MICROCHANNEL FOR ELECTRONICS COOLING1999/06/01English