Journal of Electronics Manufacturing

Title Publication Date Language Citations
SMT in Singapore: a window into the challenges and practice1993/06/01English
Development goals and present status of 3M's adhesive interconnection technology1993/12/01English
Multiple-criteria robust design of electronic devices1993/03/01English
Implementation of a decision support system for scheduling semiconductor test operations1993/09/01English
Multichip modules (MCMs): a review of the status quo1993/03/01English
Conductive adhesives as die-bonding materials for power electric modules1993/12/01English
Performance evaluation of dispatching rules for semiconductor testing operations1993/06/01English
Competing in the electronics industry: benchmarking world-class performers1993/03/01English
Application of ink screening models to solder paste printing in SMT assembly1993/09/01English
Printed circuit board panel layout optimization: a module in integrating PCB design and manufacturing databases1993/06/01English
PROPERTIES OF CONDUCTIVE ADHESIVES BASED ON ANHYDRIDE-CURED EPOXY SYSTEMS1999/09/01English
PRINTED CIRCUIT BOARD MANUFACTURING AND TESTING OF RIMM™1999/09/01English
EVALUATION OF PLASMA TREATED HASL FINISH PCBs USING DCA MEASUREMENTS1999/09/01English
INSUFFICIENT SOLDER AND SOLDER BRIDGES: AN EXPERIMENTAL STUDY OF THE INTERRELATIONS BETWEEN ASSEMBLY PROCESS FAULTS1996/06/01English
A SIMULATION OF EVAPORATING MENISCUS-DRIVEN FLOW FOR APPLICATION TO ELECTRONICS COOLING DESIGN1996/12/01English
AN INTEGRATED DECISION-SUPPORT ENVIRONMENT FOR DFX AUDIT1996/09/01English
STENCIL OPTIMIZATION VIA FLOW CONTROL1996/09/01English
A REVIEW ON DIRECT LIQUID COOLING CHANNEL FLOW WITH SINGLE-PHASE FOR ELECTRONIC SYSTEMS1996/06/01English
PCB DEFECT BEHAVIOR ASSOCIATED WITH THE USE OF THREE NO-CLEAN FLUXES AND VARYING WAVE SOLDERING PROCESS ATMOSPHERES1996/03/01English
FLOW MODELING OF PQFP DURING TRANSFER MOLDING1996/06/01English
EXPERIMENTAL STUDY OF SOLDER JOINT RELIABILITY IN A 256 PIN, 0.4 MM PITCH PQFP1996/06/01English
A MODEL TO EXPLAIN SMT OPEN CIRCUIT JOINTS ASSOCIATED WITH ADJACENT SOLDER BRIDGES1996/03/01English
A STUDY OF SOLDERABILITY AND SOLDER SPREADING FOR SMT OPEN JOINTS1996/12/01English
THE ELECTRICAL AND MECHANICAL PROPERTIES OF ELECTRICALLY CONDUCTIVE ADHESIVES IN PIN-THROUGH-HOLE APPLICATIONS1996/09/01English
THE ORIGIN AND PREVENTION OF POST REFLOW DEFECTS IN SURFACE MOUNT ASSEMBLY1996/03/01English
YIELD ESTIMATION THROUGH COMPONENT PLACEMENT ACCURACY EVALUATION IN SURFACE MOUNT PWB ASSEMBLY1996/03/01English
A REVIEW ON COOLING BY CHANNEL FLOW BOILING FOR ELECTRONIC SYSTEMS1996/09/01English
Book Review: "High-Frequency Analog Integrated Circuit Design", Ravender Goyal (Editor)1996/12/01English
THE SOLDERABILITY EVALUATION OF SURFACE MOUNT COMPONENTS THROUGH THE USE OF WETTING BALANCE ANALYSIS1996/03/01English
STATISTICAL PROCESS CONTROL FOR TEST AND SCAN PROCESSES AT FINAL TEST OPERATION OF AN INTEGRATED CIRCUIT1996/03/01English