Journal of Electronics Manufacturing

Title Publication Date Language Citations
Book reviews: "Solder paste in electronics packaging: Technology and Applications in Surface Mount, Hybrid Circuits and Components Assembly"1991/09/01English
Controlled environment processing for semiconductors: a factory-in-a-bottle (a lean manufacturing alternative)1991/09/01English
Second-generation SM component designs1991/12/01English
Solderless assembly reduces cost, hazards and pollution1992/03/01English
Book review: "Testing semiconductor memories — theory and practice", A. J. van de Goor1992/09/01English
Book review: "Foundations for microstrip circuit design", T. Edwards1992/06/01English
Fine-pitch connection to rigid substrate using non-conductive epoxy adhesive1992/03/01English
TEST: a design-for-testability system for printed wiring boards1992/06/01English
A cost estimation tool for printed circuit board assembly1992/12/01English
Book review: "The Japanese Semiconductor Industry, an Executive Assessment"1992/12/01English
Wafer handling with levitation1992/09/01English
A shifting bottleneck algorithm for scheduling semiconductor testing operations1992/09/01English
Modeling the epitaxial growth of gallium arsenide1991/09/01English
Productivity model for electronics design1992/06/01English
Relation between contaminations and solder joint failures1992/03/01English
Automatic in-process inspection during robotic PCBA rework1992/06/01English
An enhanced Taguchi method for optimizing SMT processes1992/09/01English
Issues in the manufacture of automotive modules with fine-pitch devices1991/12/01English
Placement design for producibility1991/12/01English
Vendor selection, qualification and management for SMT module assembly1991/12/01English
Off- and on-line techniques to optimize processes1991/09/01English
Book review: "Concurrent engineering and design for manufacture of electronics products", Sammy G. Shina1992/06/01English
Issues in the testability of printed wiring boards1992/06/01English
A simple model for fatigue of leadless ceramic chip carrier solder attachments1992/03/01English
Crack growth rate measurements in surface-mount solder joints1992/03/01English
A collision-free sequencing algorithm for PWB assembly1991/09/01English
The concurrent engineering approach to product development1991/12/01English
Topographic profiling and dimensional measurement of VLSI structure by scanning tunneling microscopy1992/12/01English
Book review: "Design to Test: A definitive guide for electronic design, manufacture, and service", Second Edition, John L. Turino1992/03/01English
Experimental study of stencil/substrate separation speed in on-contact solder paste printing for reflow soldering1993/03/01English