IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C

Title Publication Date Language Citations
Assembly of planar array components using anisotropic conducting adhesives-a benchmark study: II. Theory1996/01/013
Yield enhancement of a 16.6 cm/sup 2/ monolithic large-area integrated multiprocessor system using laser reconfiguration1996/04/012
Automated removal and replacement of surface mounted devices in electronic assembly1997/07/012
Integrated circuit packaging industry in Taiwan1997/01/012
Advanced encapsulant systems for flip-chip-on-board assemblies: underfills with improved manufacturing properties1998/07/012
A study of ESD protection devices for input pins discharge characteristics of diode, lateral bipolar transistor, and thyristor under MM and HBM tests1998/10/012
The development of repairable Au-Al solid phase diffusion flip-chip bonding1997/01/012
Gas flow effects on precision solder self-alignment1997/01/012
Automated removal and replacement of through-hole components in robotic rework1997/07/012
A robust metric for measuring within-wafer uniformity1996/01/012
Yield learning in integrated circuit package assembly1997/04/012
The development of Taiwan's integrated circuit industry1997/01/012
Technology and change in the Chinese electronics industry1997/04/012
Metallurgical considerations for accelerated testing of soft solder joints1997/07/012
Material-centric modeling of PWB fabrication: an economic and environmental comparison of conventional and photovia board fabrication processes1998/04/012
Designing process tolerances to minimize loss of nonconforming parts1997/01/012
A design for assembly evaluation methodology for photonic systems1996/07/012
Manufacturing process for combination lead frame/TAB BGA1998/07/011
Heat-transfer enhancing features for handler tray-type device carriers1998/10/011
Mechatronics in storage technology1997/01/011
Solder transfer technique for flip-chip and electronic assembly applications1998/07/011
Developing reusable modeling capabilities for simulating high volume electronics manufacturing systems1996/04/011
An assessment of the electronics industry in Southeast Asia1997/01/011
Protection of high voltage power and programming pins1998/10/011
A novel structure to realize crack-free plastic package during reflow soldering process-development of Chip Side-Support (CSS) package1996/01/011
Addressing environment, health, and safety in semiconductor process development1998/07/011
Electrical characterization of laser machined and metallized vias in AlN with thick film interconnect1998/04/011
On the optimization aspects of parameterized neurocontrol (PNC) design1996/01/011
FCOB reliability evaluation simulating multiple rework/reflow processes1996/01/011
Area bonding conductive epoxy adhesives for low-cost grid array chip carriers1996/07/011