IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C

Title Publication Date Language Citations
Energy model for end-of-life computer disposition1998/10/01
First International Conference On Electronic Assembly1997/07/01English
Foreword Materials And Process Challenges-contributions From The First International Conference On Electronic Assembly1997/07/01
The Second "Adhesives '96" International Conference1996/10/01English
Abstracts of manuscripts in issue1998/07/01
Frontiers of Electronic Commerce [Book Reviews]1996/04/01
High Temperature Electronics [Book Reviews]1998/07/01
Abstracts1998/04/01
The 17th EOS/ESD Symposium1996/07/01English
Air Cooling Technologies For Electronic Equipment [Book Reviews]1998/07/01
Foreword Special Issue On The Latest Advances In IC Manufacturing In Asia1997/10/01
1997 Index IEEE Transactions on Components, Packaging, And Manufacturing Technology, Part C: Manufacturing Vol. 201997/10/01
1996 Index IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part C: Manufacturing Vol. 191996/10/01
Nonhermetic plastic packaging of high voltage electronic switches utilizing a low-stress glob coating for 95/5Pb/Sn solder joints of flip-chip bonded multichip module high voltage devices1998/01/01
Reactions of high lead solders with BIOACT EC-7R semi-aqueous cleaning reagents1996/04/01
Effect of polyimide processing on multichip glass ceramic module fabrications1996/01/01
Inside front cover1998/10/01
Front cover1998/10/01
Micromechatronics and the miniaturization of structures, devices, and systems1997/01/01
Thermal preprocessing to shorten flows, simplify lithography, and radically reduce processing cycle time1996/04/01
Case studies on design of mechatronic products1997/01/01
Thermal modeling of a double-neck large diameter crystal growth process1998/04/01
Lasersonic bonding of TAB components to epoxy-glass circuit boards1996/01/01
Compression flow modeling of underfill encapsulants for low cost flip-chip assembly1998/10/01
Use of compliant adhesives in the large area processing of MCM-D substrates1998/10/01
The behavior of solder pastes in stencil printing with vibrating squeegee1998/10/01
[Back cover]1998/10/01
[Back inside cover]1998/10/01
1998 Index: IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part C: Manufacturing Vol. 211998/10/01
Design for semiconductor manufacturing. Bibliography1997/01/01