IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C

Title Publication Date Language Citations
Assembly of planar array components using anisotropic conducting adhesives-a benchmark study: pt.I. Experiment1996/01/017
Investigation of electronic assembly design alternatives through production modeling of life cycle impacts, costs, and yield1997/01/017
A study of the reliability of brazed Al/sub O3/ joint systems1998/07/017
Development of Ba-Ti-B glass-ceramic thick-film capacitors by sol-gel technology1998/01/016
Use of neural networks in modeling relations between exposure energy and pattern dimension in photolithography process [MOS ICs]1996/01/016
Manufacturing products with end-of-life considerations: an economic assessment to the routes of revenue generation from mature products1998/01/016
A dispatching scheme involving move control and weighted due date for wafer foundries1997/01/016
Mechanical failure in COB-technology using glob-top encapsulation1996/10/016
Materials to integrate the solder reflow and underfill encapsulation processes for flip chip on board assembly1998/01/016
Optimization for thermal and electrical wiring for a flip-chip package using physical-neural network modeling1998/04/016
Sequential processing mechanics modeling for a model IC package1997/01/015
Using a neural network-based approach to predict the wafer yield in integrated circuit manufacturing1997/01/015
Function approximation and neural-fuzzy approach to machining process selection1996/01/015
Flip chip bonding technique using transferred microsolder bumps1997/01/015
A scheduling system for IC packaging industry using STEP enabling technology1997/01/015
Advanced CMOS protection device trigger mechanisms during CDM1996/07/015
Foreword: Electrical overstress/electrostatic discharge1998/10/014
Fuzzy logic models with improved accuracy and continuous differentiability1996/01/014
A stair-like CIM system architecture1997/04/014
Excimer laser projection micromachining of polyimide thin films annealed at different temperatures1996/07/014
Surface insulation resistance methodology for today's manufacturing technology1996/01/014
Active Controller: utilizing active databases for implementing multistep control of semiconductor manufacturing1998/07/014
ESD evaluation methods for a charged device model1996/07/013
Process induced residual stresses in isotropically conductive adhesive joints1996/01/013
Molding challenges of LOC packages with large devices1998/04/013
A new approach to chip size package using meniscus soldering and FPC-bonding1998/01/013
Design for semiconductor manufacturing. Perspective1997/01/013
Editorial1998/10/013
A fast and accurate method for measuring the dielectric constant of printed wiring board materials1996/07/013
Automatic classification of wafer defects: status and industry needs1997/04/013