IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C

Title Publication Date Language Citations
Underfill flow as viscous flow between parallel plates driven by capillary action1996/04/0174
Electrically conductive adhesives for surface mount solder replacement1996/01/0156
Surface micromachined solenoid inductors for high frequency applications1998/01/0151
Run by run control of chemical-mechanical polishing1996/10/0147
Equipment fault detection using spatial signatures1997/01/0134
A self-tuning EWMA controller utilizing artificial neural network function approximation techniques1997/04/0132
Intelligent X-ray inspection for quality control of solder joints1997/04/0132
Novel clamp circuits for IC power supply protection1996/07/0129
Modeling the cost of ownership of assembly and inspection1996/01/0126
Oxidation and reduction kinetics of eutectic SnPb, InSn, and AuSn: a knowledge base for fluxless solder bonding applications1998/04/0125
In-situ measurements of surface mount IC package deformations during reflow soldering1997/07/0123
Very fast transmission line pulsing of integrated structures and the charged device model1998/10/0122
Flip chip attachment using anisotropic conductive adhesives and electroless nickel bumps1997/04/0122
Effective modeling of the reflow soldering process: basis, construction, and operation of a process model1998/04/0121
Design of modular digital circuits for testability1997/01/0121
Reactive ion etching of benzocyclobutene polymer films1997/07/0120
Improvements to X-ray laminography for automated inspection of solder joints1998/04/0118
The design of due date assignment model and the determination of flow time control parameters for the wafer fabrication factories1997/01/0117
Reactive ion etch modeling using neural networks and simulated annealing1996/01/0117
Artificial neural network model-based run-to-run process controller1996/01/0117
Real-time diagnosis of semiconductor manufacturing equipment using a hybrid neural network expert system1997/01/0116
Fine pitch stencil printing of Sn/Pb and lead free solders for flip chip technology1998/01/0116
Designed experiments to investigate the solder joint quality output of a prototype automated surface mount replacement system1998/07/0115
Fabrication of two-dimensional fiber arrays using microferrules1998/01/0115
Solder paste print qualification using laser triangulation1997/07/0115
Alternative facility layouts for semiconductor wafer fabrication facilities1997/04/0114
The effects of flux materials on the moisture sensitivity and reliability of flip-chip-on-board assemblies1998/07/0114
Development and validation of a lead-free alloy for solder paste applications1997/07/0113
Mechatronics. An overview1997/01/0112
Numerical calculation and measurement of transient fields from electrostatic discharges1996/07/0112