IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C

Title Publication Date Language Citations
Effect of copper lamination on the rheological and copper adhesion properties of a thermotropic liquid crystalline polymer used in PCB applications1997/07/0112
Designing response surface model-based run-by-run controllers: a worst case approach1996/04/0111
Diffusion model to derate moisture sensitive surface mount IC's for factory use conditions1996/04/0111
Electrical failure of multilayer ceramic capacitors subjected to environmental screening testing1996/04/0111
Estimating tools to support multipath agility in electronics manufacturing1996/01/0111
Abstracts1998/10/0110
Manufacturing concerns when soldering with gold plated component leads or circuit board pads1997/07/0110
Challenges in determining electronics equipment take-back levels1998/07/0110
Influence of well profile and gate length on the ESD performance of a fully silicided 0.25 μm CMOS technology1998/10/019
The development of reflowable materials systems to integrate the reflow and underfill dispensing processes for DCA/FCOB assembly1997/07/019
The impact of technology scaling on ESD robustness of aluminum and copper interconnects in advanced semiconductor technologies1998/10/018
Mechatronics challenge for the higher education world1997/01/018
Integration steps of a fully-automated remanufacturing cell system for fine-pitch surface mounted devices1998/01/018
Effective modeling of the reflow soldering process: use of a modeling tool for product and process design1998/07/018
A generic IDEFO model of quality assurance information systems for the design-to-order manufacturing environment1996/04/017
Modeling component placement errors in surface mount technology using neural networks1998/01/017
Assembly of planar array components using anisotropic conducting adhesives-a benchmark study: pt.I. Experiment1996/01/017
Investigation of electronic assembly design alternatives through production modeling of life cycle impacts, costs, and yield1997/01/017
A study of the reliability of brazed Al/sub O3/ joint systems1998/07/017
Development of Ba-Ti-B glass-ceramic thick-film capacitors by sol-gel technology1998/01/016
Use of neural networks in modeling relations between exposure energy and pattern dimension in photolithography process [MOS ICs]1996/01/016
Manufacturing products with end-of-life considerations: an economic assessment to the routes of revenue generation from mature products1998/01/016
A dispatching scheme involving move control and weighted due date for wafer foundries1997/01/016
Mechanical failure in COB-technology using glob-top encapsulation1996/10/016
Materials to integrate the solder reflow and underfill encapsulation processes for flip chip on board assembly1998/01/016
Optimization for thermal and electrical wiring for a flip-chip package using physical-neural network modeling1998/04/016
Sequential processing mechanics modeling for a model IC package1997/01/015
Using a neural network-based approach to predict the wafer yield in integrated circuit manufacturing1997/01/015
Function approximation and neural-fuzzy approach to machining process selection1996/01/015
Flip chip bonding technique using transferred microsolder bumps1997/01/015