IEEE Transactions on Advanced Packaging

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Journal Properties
  • Continued as
    IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, IEEE Transactions on Components, Packaging and Manufacturing Technology
  • Language
    English
  • Number of Articles
    1,302
  • Abbreviation
    IEEE Trans Adv Packag
  • ISSN
    1521-3323
  • e-ISSN
    1557-9980
  • Main Publisher
    IEEE
  • Publisher
    Institute of Electrical and Electronics Engineers (IEEE)
  • Indian UGC
  • DOAJ (latest)
Description
IEEE Transactions on Advanced Packaging showcases the latest advancements in electronics packaging. With a focus on miniaturization and performance, the journal explores cutting-edge materials, processes, and designs for advanced packaging technologies. Key topics include 3D integration, wafer-level packaging, thermal management, and signal integrity. Indexed in prominent databases such as Scopus and Web of Science, it is essential reading for researchers and engineers. This journal delves into topics like modeling and simulation for packaging, novel interconnect technologies, and reliability assessments. It also examines emerging trends in materials science, focusing on polymers, ceramics, and nanostructure materials used in advanced packaging. Addressing challenges related to power delivery, signal integrity, and thermal dissipation in high-performance electronic devices. Targeted towards industry professionals, academic researchers, and graduate students specializing in microelectronics and materials science. By offering deep insights into the future of electronics packaging, the journal aims to foster innovation and contribute to the creation of smaller, faster, and more reliable electronic devices. Submit your research to contribute to this important field.