IEEE Transactions on Advanced Packaging

Title Publication Date Language Citations
Power distribution system design methodology and capacitor selection for modern CMOS technology1999/01/01131
MEMS post-packaging by localized heating and bonding2000/01/0187
Wafer level chip scale packaging (WL-CSP): an overview2000/05/0176
Silver metallization for advanced interconnects1999/01/0176
Factors influencing the permittivity of polymer/ceramic composites for embedded capacitors2000/05/0174
The contact resistance and reliability of anisotropically conductive film (ACF)1999/05/0171
High density interconnects and flexible hybrid assemblies for active biomedical implants2001/08/0164
Thermal component model for electrothermal analysis of IGBT module systems2001/01/0163
Modeling and transient simulation of planes in electronic packages2000/01/0160
Efficient passive circuit models for distributed networks with frequency-dependent parameters2000/01/0159
Comparative study of thermally conductive fillers for use in liquid encapsulants for electronic packaging1999/01/0159
Modeling of irregular shaped power distribution planes using transmission matrix method2001/01/0155
Rate dependent constitutive relations based on Anand model for 92.5Pb5Sn2.5Ag solder2000/01/0155
An overview of solder bump shape prediction algorithms with validations2001/05/0153
Modeling of simultaneous switching noise in high speed systems2001/05/0151
A high-performance hybrid electrical-optical interconnection technology for high-speed electronic systems2001/01/0151
Reducing simultaneous switching noise and EMI on ground/power planes by dissipative edge termination1999/01/0150
Reliability of thick Al wire bonds in IGBT modules for traction motor drives2000/01/0143
Mounting of high power laser diodes on boron nitride heat sinks using an optimized Au/Sn metallurgy2001/01/0142
Reliability studies μBGA solder joints-effect of Ni-Sn intermetallic compound2001/01/0140
Time domain modeling of lossy interconnects2001/05/0139
Die cracking and reliable die design for flip-chip assemblies1999/01/0139
Empirical equations on electrical parameters of coupled microstrip lines for crosstalk estimation in printed circuit board2001/01/0138
Flip chip on board solder joint reliability analysis using 2-D and 3-D FEA models2001/01/0136
Study of fluxless soldering using formic acid vapor1999/01/0136
Reaction of solder with Ni/Au metallization for electronic packages during reflow soldering2001/01/0134
Heat transfer from pin-fin heat sinks under multiple impinging jets2000/01/0134
Resonant free power network design using extended adaptive voltage positioning (EAVP) methodology2001/01/0133
An innovative technique for packaging power electronic building blocks using metal posts interconnected parallel plate structures1999/05/0133
The effects of underfill and its material models on thermomechanical behaviors of a flip chip package2001/01/0132