Materials for interconnects
Article Properties
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LanguageEnglish
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DOI (url)
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Publication Date2021/10/01
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Journal
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Indian UGC (journal)
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Refrences60
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Citations37
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Daniel Gall ORCID (unauthenticated)
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Judy J. Cha
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Zhihong Chen
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Hyeuk-Jin Han
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Christopher Hinkle
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Joshua A. Robinson
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Ravishankar Sundararaman
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Riccardo Torsi
Cite
Gall, Daniel, et al. “Materials for Interconnects”. MRS Bulletin, vol. 46, no. 10, 2021, pp. 959-66, https://doi.org/10.1557/s43577-021-00192-3.
Gall, D., Cha, J. J., Chen, Z., Han, H.-J., Hinkle, C., Robinson, J. A., Sundararaman, R., & Torsi, R. (2021). Materials for interconnects. MRS Bulletin, 46(10), 959-966. https://doi.org/10.1557/s43577-021-00192-3
Gall, Daniel, Judy J. Cha, Zhihong Chen, Hyeuk-Jin Han, Christopher Hinkle, Joshua A. Robinson, Ravishankar Sundararaman, and Riccardo Torsi. “Materials for Interconnects”. MRS Bulletin 46, no. 10 (2021): 959-66. https://doi.org/10.1557/s43577-021-00192-3.
Gall D, Cha JJ, Chen Z, Han HJ, Hinkle C, Robinson JA, et al. Materials for interconnects. MRS Bulletin. 2021;46(10):959-66.
Journal Categories
Science
Chemistry
Science
Physics
Technology
Chemical technology
Technology
Electrical engineering
Electronics
Nuclear engineering
Materials of engineering and construction
Mechanics of materials
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| 14 | 2021 |
| 10.1109/TED.2020.3040202 | IEEE Transactions on Electron Devices |
| 2021 | |
| 10.1103/PhysRevMaterials.5.056002 | 2021 |
Refrences Analysis
The category
Science: Physics 60
is the most frequently represented among the references in this article. It primarily includes studies from Journal of Applied Physics and Applied Physics Letters. The chart below illustrates the number of referenced publications per year.
Refrences used by this article by year
Citations
| Title | Journal | Journal Categories | Citations | Publication Date |
|---|---|---|---|---|
Multi‐Objective Optimization for Rapid Identification of Novel Compound Metals for Interconnect Applications | Small |
| 2024 | |
| A computational investigation of electron transport in defected Cu thin films | Computational Materials Science |
| 2024 | |
| Understanding electromigration failure behaviors of narrow cobalt lines and the mechanism of reliability enhancement for extremely dilute alloying of manganese oxide | Journal of Alloys and Compounds |
| 2024 | |
| Tuning the electronic conductance of REH (RE = Nd, Ce, Pr) by structural deformation | Journal of Energy Chemistry |
| 2024 | |
High-throughput approach to explore cold metals for electronic and thermoelectric devices | npj Computational Materials |
| 2024 |
Citations Analysis
The category
Technology: Chemical technology 25
is the most commonly referenced area in studies that cite this article. The first research to cite this article was titled Materials opportunities for low-energy computing and was published in 2021. The most recent citation comes from a 2024 study titled High-throughput approach to explore cold metals for electronic and thermoelectric devices. This article reached its peak citation in 2023, with 17 citations. It has been cited in 27 different journals, 25% of which are open access. Among related journals, the Applied Physics Letters cited this research the most, with 5 citations. The chart below illustrates the annual citation trends for this article.