Advanced Interconnects: Materials, Processing, and Reliability
Article Properties
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LanguageEnglish
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DOI (url)
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Publication Date2014/12/17
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Indian UGC (journal)
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Refrences26
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Citations92
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Mikhail R. Baklanov
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Christoph Adelmann
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Larry Zhao
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Stefan De Gendt
Journal Categories
Science
Chemistry
Science
Physics
Technology
Chemical technology
Technology
Electrical engineering
Electronics
Nuclear engineering
Materials of engineering and construction
Mechanics of materials
Refrences
| Title | Journal | Journal Categories | Citations | Publication Date |
|---|---|---|---|---|
| 10.1002/9781119963677 | ||||
| 10.1002/9780470017944 | ||||
| Preparation and Characterization of Flexible Asymmetric Supercapacitors Based on Transition-Metal-Oxide Nanowire/Single-Walled Carbon Nanotube Hybrid Thin-Film Electrodes | ACS Nano |
| 674 | 2010 |
| Growth time performance dependence of vertically aligned carbon nanotube supercapacitors grown on aluminum substrates | Electrochimica Acta |
| 50 | 2013 |
| 10.1007/BF02692434 |
Citations
| Title | Journal | Journal Categories | Citations | Publication Date |
|---|---|---|---|---|
Challenges in scaling of IPVD deposited Ta barriers on OSG low‐k films: Carbonization of Ta by CHx radicals generated through VUV‐induced decomposition of carbon‐containing groups | Plasma Processes and Polymers |
| 2024 | |
| Al3Sc thin films for advanced interconnect applications | Microelectronic Engineering |
| 1 | 2024 |
| Fatigue spectrum prediction and stretching force estimation of free-standing thin-film membranes for semiconductor manufacturing | Materials Science in Semiconductor Processing |
| 2024 | |
| Etch characteristics of cobalt thin films using high density plasma of halogen gas | Thin Solid Films |
| 2024 | |
| Vapor-Phase Self-Assembled Monolayer With Functional Groups as a Copper Diffusion Barrier Layer for InSnZnO Thin-Film Transistors | IEEE Transactions on Electron Devices |
| 2024 |
Citations Analysis
The category
Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials 66
is the most commonly referenced area in studies that cite this article. The first research to cite this article was titled Chemical vapour deposition of zeolitic imidazolate framework thin films and was published in 2015. The most recent citation comes from a 2024 study titled Etch characteristics of cobalt thin films using high density plasma of halogen gas. This article reached its peak citation in 2022, with 14 citations. It has been cited in 65 different journals, 12% of which are open access. Among related journals, the Journal of The Electrochemical Society cited this research the most, with 5 citations. The chart below illustrates the annual citation trends for this article.