Ultraprecise Printing of D-Band Transmission Lines
Article Properties
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DOI (url)
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Publication Date2023/10/01
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Indian UGC (journal)
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Refrences11
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Martin Roemhild Institute for Large Area Microelectronics (IGM), University of Stuttgart, Stuttgart, Germany ORCID (unauthenticated)
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Georg Gramlich Institute of Radio Frequency Engineering and Electronics (IHE), Karlsruhe Institute of Technology, Karlsruhe, Germany ORCID (unauthenticated)
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Holger Baur Institute for Large Area Microelectronics (IGM), University of Stuttgart, Stuttgart, Germany
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Thomas Zwick Institute of Radio Frequency Engineering and Electronics (IHE), Karlsruhe Institute of Technology, Karlsruhe, Germany ORCID (unauthenticated)
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Norbert Fruehauf Institute for Large Area Microelectronics (IGM), University of Stuttgart, Stuttgart, Germany
Cite
Roemhild, Martin, et al. “Ultraprecise Printing of D-Band Transmission Lines”. IEEE Microwave and Wireless Technology Letters, vol. 33, no. 10, 2023, pp. 1419-22, https://doi.org/10.1109/lmwt.2023.3300569.
Roemhild, M., Gramlich, G., Baur, H., Zwick, T., & Fruehauf, N. (2023). Ultraprecise Printing of D-Band Transmission Lines. IEEE Microwave and Wireless Technology Letters, 33(10), 1419-1422. https://doi.org/10.1109/lmwt.2023.3300569
Roemhild M, Gramlich G, Baur H, Zwick T, Fruehauf N. Ultraprecise Printing of D-Band Transmission Lines. IEEE Microwave and Wireless Technology Letters. 2023;33(10):1419-22.
Journal Categories
Technology
Electrical engineering
Electronics
Nuclear engineering
Electric apparatus and materials
Electric circuits
Electric networks
Technology
Electrical engineering
Electronics
Nuclear engineering
Electronics
Technology
Engineering (General)
Civil engineering (General)
Refrences
| Title | Journal | Journal Categories | Citations | Publication Date |
|---|---|---|---|---|
| High-resolution deposition of conductive and insulating materials at micrometer scale on complex substrates | Scientific Reports |
| 2022 | |
| High-resolution deposition of conductive and insulating materials at micrometer scale on complex substrates | 2011 | |||
| CAD models for shielded multilayered CPW | IEEE Transactions on Microwave Theory and Techniques |
| 81 | 1995 |
| 10.1109/ESTC55720.2022.9939386 | ||||
Ultra‐Thin Chips with Printed Interconnects on Flexible Foils | Advanced Electronic Materials |
| 19 | 2021 |