Ultra‐Thin Chips with Printed Interconnects on Flexible Foils
Article Properties
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LanguageEnglish
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DOI (url)
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Publication Date2021/12/30
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Journal
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Indian UGC (journal)
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Refrences56
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Citations19
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Sihang Ma Bendable Electronics and Sensing Technologies (BEST) Group University of Glasgow Glasgow G12 8QQ UK
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Yogeenth Kumaresan Bendable Electronics and Sensing Technologies (BEST) Group University of Glasgow Glasgow G12 8QQ UK
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Abhishek Singh Dahiya Bendable Electronics and Sensing Technologies (BEST) Group University of Glasgow Glasgow G12 8QQ UK
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Ravinder Dahiya Bendable Electronics and Sensing Technologies (BEST) Group University of Glasgow Glasgow G12 8QQ UK ORCID (unauthenticated)
Abstract
Cite
Ma, Sihang, et al. “Ultra‐Thin Chips With Printed Interconnects on Flexible Foils”. Advanced Electronic Materials, vol. 8, no. 5, 2021, https://doi.org/10.1002/aelm.202101029.
Ma, S., Kumaresan, Y., Dahiya, A. S., & Dahiya, R. (2021). Ultra‐Thin Chips with Printed Interconnects on Flexible Foils. Advanced Electronic Materials, 8(5). https://doi.org/10.1002/aelm.202101029
Ma S, Kumaresan Y, Dahiya AS, Dahiya R. Ultra‐Thin Chips with Printed Interconnects on Flexible Foils. Advanced Electronic Materials. 2021;8(5).
Journal Categories
Science
Chemistry
Science
Physics
Technology
Chemical technology
Technology
Electrical engineering
Electronics
Nuclear engineering
Electric apparatus and materials
Electric circuits
Electric networks
Technology
Electrical engineering
Electronics
Nuclear engineering
Materials of engineering and construction
Mechanics of materials
Refrences
| Title | Journal | Journal Categories | Citations | Publication Date |
|---|---|---|---|---|
| Flexible Electronics | 2018 | |||
| Materials for Advanced Packaging | 2017 | |||
| 10.1002/9783527691685 | ||||
| Study of temperature parameter on the thermosonic gold wire bonding of high-speed CMOS | IEEE Transactions on Components, Hybrids, and Manufacturing Technology | 22 | 1991 | |
| In situ ultrasonic force signals during low-temperature thermosonic copper wire bonding | Microelectronic Engineering |
| 31 | 2008 |
Citations
| Title | Journal | Journal Categories | Citations | Publication Date |
|---|---|---|---|---|
Hybrid chips to enable a sustainable internet of things technology: opportunities and challenges | Discover Materials |
| 1 | 2024 |
Fabrication of RC filters from a single printed Zn layer by reactive inkjet printing | Flexible and Printed Electronics |
| 2024 | |
Out‐of‐Plane Electronics on Flexible Substrates Using Inorganic Nanowires Grown on High‐Aspect‐Ratio Printed Gold Micropillars | Advanced Materials |
| 5 | 2023 |
Tunable Conductive Composite for Printed Sensors and Embedded Circuits | Advanced Intelligent Systems |
| 2023 | |
| Printed n- and p-Channel Transistors using Silicon Nanoribbons Enduring Electrical, Thermal, and Mechanical Stress | ACS Applied Materials & Interfaces |
| 3 | 2023 |
Citations Analysis
The category
Science: Chemistry 9
is the most commonly referenced area in studies that cite this article. The first research to cite this article was titled Printing of Nano‐ to Chip‐Scale Structures for Flexible Hybrid Electronics and was published in 2022. The most recent citation comes from a 2024 study titled Fabrication of RC filters from a single printed Zn layer by reactive inkjet printing. This article reached its peak citation in 2022, with 9 citations. It has been cited in 17 different journals, 17% of which are open access. Among related journals, the IEEE Journal on Flexible Electronics cited this research the most, with 2 citations. The chart below illustrates the annual citation trends for this article.