A HARPSS polysilicon vibrating ring gyroscope
Article Properties
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DOI (url)
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Publication Date2001/06/01
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Indian UGC (journal)
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Refrences17
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Citations209
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F. Ayazi
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K. Najafi
Cite
Ayazi, F., and K. Najafi. “A HARPSS Polysilicon Vibrating Ring Gyroscope”. Journal of Microelectromechanical Systems, vol. 10, no. 2, 2001, pp. 169-7, https://doi.org/10.1109/84.925732.
Ayazi, F., & Najafi, K. (2001). A HARPSS polysilicon vibrating ring gyroscope. Journal of Microelectromechanical Systems, 10(2), 169-179. https://doi.org/10.1109/84.925732
Ayazi, F., and K. Najafi. “A HARPSS Polysilicon Vibrating Ring Gyroscope”. Journal of Microelectromechanical Systems 10, no. 2 (2001): 169-79. https://doi.org/10.1109/84.925732.
1.
Ayazi F, Najafi K. A HARPSS polysilicon vibrating ring gyroscope. Journal of Microelectromechanical Systems. 2001;10(2):169-7.
Journal Categories
Science
Mathematics
Instruments and machines
Science
Physics
Technology
Chemical technology
Technology
Electrical engineering
Electronics
Nuclear engineering
Electric apparatus and materials
Electric circuits
Electric networks
Technology
Engineering (General)
Civil engineering (General)
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Refrences
| Title | Journal | Journal Categories | Citations | Publication Date |
|---|---|---|---|---|
| a high aspect-ratio polysilicon vibrating ring gyroscope | 2000 | |||
| lateral gyroscope suspended by two gimbals through high aspect ratio icp etching | 1999 | |||
| performance and design of a silicon micromachined gyro | 1997 | |||
| a micromachined vibrating ring gyroscope | 1994 | |||
| a micromachined comb-drive tuning fork gyroscope for commercial applications | 1994 |
Citations
| Title | Journal | Journal Categories | Citations | Publication Date |
|---|---|---|---|---|
| Theoretical thermoelastic damping for micro ring gyroscopes by wave propagation | International Journal of Mechanical Sciences |
| 1 | 2024 |
A 3D-printed microhemispherical shell resonator with electrostatic tuning for a Coriolis vibratory gyroscope | Microsystems & Nanoengineering |
| 2024 | |
A MEMS Disk Gyroscope with High Fabrication Precision, High Quality Factor (>810k) and High Overload Characteristic (>15000g) | Journal of Physics: Conference Series | 2024 | ||
MEMS and MOEMS Gyroscopes: A Review | Photonic Sensors |
| 2023 | |
| Analytical Model for Thermoelastic Damping in In-Plane Vibrations of Circular Cross-Sectional Micro/Nanorings with Dual-Phase-Lag Heat Conduction | Journal of Vibration Engineering & Technologies |
| 5 | 2023 |
Citations Analysis
The category
Technology: Engineering (General). Civil engineering (General) 115
is the most commonly referenced area in studies that cite this article. The first research to cite this article was titled Tailoring of Stress Development in MEMS Packaging Systems and was published in 2002. The most recent citation comes from a 2024 study titled A MEMS Disk Gyroscope with High Fabrication Precision, High Quality Factor (>810k) and High Overload Characteristic (>15000g). This article reached its peak citation in 2021, with 20 citations. It has been cited in 80 different journals, 21% of which are open access. Among related journals, the Sensors and Actuators A: Physical cited this research the most, with 23 citations. The chart below illustrates the annual citation trends for this article.