On hillocks generated during anisotropic etching of Si in TMAH
Article Properties
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DOI (url)
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Publication Date1996/06/01
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Indian UGC (journal)
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Refrences33
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Citations76
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L.M. Landsberger
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S. Naseh
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M. Kahrizi
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M. Paranjape
Journal Categories
Science
Mathematics
Instruments and machines
Science
Physics
Technology
Chemical technology
Technology
Electrical engineering
Electronics
Nuclear engineering
Electric apparatus and materials
Electric circuits
Electric networks
Technology
Engineering (General)
Civil engineering (General)
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Refrences
| Title | Journal | Journal Categories | Citations | Publication Date |
|---|---|---|---|---|
| Inhibition of pyramid formation in the etching of Si p(100) in aqueous potassium hydroxide-isopropanol | Journal of Micromechanics and Microengineering |
| 88 | 1995 |
| tmah/ipa anisotropic etching characteristics | 1993 | |||
| on pyramidal protrusions in anisotropic etching of | 1993 | |||
| nh | 1990 | |||
| fabrication of novel three-dimensional microstructures by the anisotropic etching of | 1978 |
Citations
| Title | Journal | Journal Categories | Citations | Publication Date |
|---|---|---|---|---|
| Wet chemical etching of silicon for conically textured surfaces | Journal of Materials Science |
| 2024 | |
Hafnium oxide: A thin film dielectric with controllable etch resistance for semiconductor device fabrication | AIP Advances |
| 4 | 2023 |
| Anisotropic wet etching of a novel micro-texture structure for an Al/n-Si/Al metal–semiconductor–metal photodetector fabrication | Journal of Micromechanics and Microengineering |
| 2021 | |
| Forming Si nanocrystals on insulator by wet anisotropic etching | Thin Solid Films |
| 1 | 2020 |
A novel silicon etching method using vapor of tetramethylammonium hydroxide solution | Chinese Journal of Chemical Physics |
| 2020 |
Citations Analysis
The category
Science: Physics 52
is the most commonly referenced area in studies that cite this article. The first research to cite this article was titled On hillocks generated during anisotropic etching of Si in TMAH and was published in 1996. The most recent citation comes from a 2024 study titled Wet chemical etching of silicon for conically textured surfaces. This article reached its peak citation in 2016, with 8 citations. It has been cited in 39 different journals, 7% of which are open access. Among related journals, the Journal of Micromechanics and Microengineering cited this research the most, with 11 citations. The chart below illustrates the annual citation trends for this article.