IEEE Transactions on Components, Packaging and Manufacturing Technology

Title Publication Date Language Citations
Fundamental Cooling Limits for High Power Density Gallium Nitride Electronics2015/06/013
Broadband Microwave Frequency Characterization of 3-D Printed Materials2013/12/013
Recent Advances and Trends in Advanced Packaging2022/02/013
Measurement and Analysis of a High-Speed TSV Channel2012/10/013
Electrical Properties of Nanocrystalline CuCr25 Contact Material2013/04/013
Single-Layer Broadband Phase Shifter Using Multimode Resonator and Shunt $\lambda $ /4 Stubs2017/07/013
MEMS Packaging Reliability in Board-Level Drop Tests Under Severe Shock and Impact Loading Conditions–Part I: Experiment2016/11/013
Metallic Nanowires and Their Application2016/12/012
Additive Manufacturing of Hetero-Magnetic Coupled Inductors2021/06/012
Study on Cu Protrusion of Through-Silicon Via2013/05/012
Conformability of a Thin Elastic Membrane Laminated on a Rigid Substrate With Corrugated Surface2015/09/012
Mechanical Designs for Inorganic Stretchable Circuits in Soft Electronics2015/09/012
5-Gb/s and 10-GHz Center-Frequency Gaussian Monocycle Pulse Transmission Using 65-nm Logic CMOS With On-Chip Dipole Antenna and High-<inline-formula> <tex-math notation="TeX">\(\kappa \) </tex-math></inline-formula> Interposer2014/07/012
Analytical Solution for Temperature Rise in Complex Multilayer Structures With Discrete Heat Sources2014/05/012
Effect of Formic Acid Vapor <italic>In Situ</italic> Treatment Process on Cu Low-Temperature Bonding2014/06/012
Thermal Spreading Resistance and Heat Source Temperature in Compound Orthotropic Systems With Interfacial Resistance2013/11/012
Evaluation of Lead-Free Solder Bump Voiding Ball Grid Array Packages Using Laser Ultrasound and Interferometric Technique2013/08/012
Multimachine Flexible Manufacturing Cell Analysis Using a Markov Chain-Based Approach2015/03/012
A Wideband On-Interposer Passive Equalizer Design for Chip-to-Chip 30-Gb/s Serial Data Transmission2015/01/012
Characterization Methods for Ultrathin Wafer and Die Quality: A Review2014/12/012
On the Potential of Galinstan-Based Minichannel and Minigap Cooling2014/01/012
Physical and Electrical Characteristics of Silver-Copper Nanopaste as Alternative Die-Attach2014/01/012
Evaluation of Additively Manufactured Microchannel Heat Sinks2019/03/012
CNTs and Graphene-Based Diodes for Microwave and Millimeter-Wave Circuits on Flexible Substrates2016/12/012
Design and Modeling of Membrane-Based Evaporative Cooling Devices for Thermal Management of High Heat Fluxes2016/07/012
Arc Erosion Characteristics of Cu-Impregnated Carbon Materials Used for Current Collection in High-Speed Railways2018/06/012
Wire Defect Recognition of Spring-Wire Socket Using Multitask Convolutional Neural Networks2018/04/012
An 8-1 Single-Stage 10-kW Planar Gysel Power Combiner at 352 MHz2018/05/012
A Universal Approach for Designing an Unequal Branch-Line Coupler With Arbitrary Phase Differences and Input/Output Impedances2017/06/012
Modeling of Capacitive Resonant Wireless Power and Data Transfer to Deep Biomedical Implants2019/07/012