IEEE Transactions on Components, Packaging and Manufacturing Technology

Title Publication Date Language Citations
Die Attach Materials for High Temperature Applications: A Review2011/04/0111
Device-Level Thermal Management of Gallium Oxide Field-Effect Transistors2019/12/017
Design and Fabrication of Compact Inkjet Printed Antennas for Integration Within Flexible and Wearable Electronics2014/10/016
High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)2011/02/016
A Review of 5G Front-End Systems Package Integration2021/01/015
An Adaptive Machine Learning Method Based on Finite Element Analysis for Ultra Low-k Chip Package Design2021/09/015
Metallic 3-D Printed Rectangular Waveguides for Millimeter-Wave Applications2016/05/015
Anomaly Detection for Solder Joints Using β-VAE2021/12/014
Fabrication of Copper Electrode on Flexible Substrate Through Ag+-Based Inkjet Printing and Rapid Electroless Metallization2017/09/014
Numerical Simulation of Impact Effect of Internal Gas Pressure on Chamber Housing in Low-Voltage Circuit Breaker2014/04/014
3-D Printed Metal-Pipe Rectangular Waveguides2015/09/014
Theory of Thermal Time Constants in GaN High-Electron-Mobility Transistors2018/04/014
Thermal Analysis of Solder Joint Based on Eddy Current Pulsed Thermography2017/07/014
Electronics Thermal Management in Information and Communications Technologies: Challenges and Future Directions2017/08/014
Feature-Extraction-Based Inspection Algorithm for IC Solder Joints2011/05/013
Flow Boiling of R134a in a Multi-Microchannel Heat Sink With Hotspot Heaters for Energy-Efficient Microelectronic CPU Cooling Applications2011/06/013
Influence of Humidity on the Power Cycling Lifetime of SiC MOSFETs2022/11/013
The ICECool Fundamentals Effort on Evaporative Cooling of Microelectronics2021/10/013
A Novel Technique for Evaluating the Effective Permittivity of Inhomogeneous Interconnects Based on the Monotonicity Property2016/09/013
Effects of Sintering Pressure on the Densification and Mechanical Properties of Nanosilver Double-Side Sintered Power Module2019/05/013
Thermal Lifetime Calculation of Capacitor Insulation Using the Activation Energy Method2020/10/013
Wearable AMC Backed Near-Endfire Antenna for On-Body Communications on Latex Substrate2016/03/013
A Compact Microwave Device for Fracture Diagnosis of the Human Tibia2019/04/013
Stretchable Electronics Technology for Large Area Applications: Fabrication and Mechanical Characterization2013/02/013
Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring2011/02/013
Low-Cost Thin Glass Interposers as a Superior Alternative to Silicon and Organic Interposers for Packaging of 3-D ICs2012/09/013
Interface and Reliability Analysis of Au-Passivated Cu–Cu Fine-Pitch Thermocompression Bonding for 3-D IC Applications2019/07/013
Flexible Multielectrode Arrays With 2-D and 3-D Contacts for $In~ Vivo$ Electromyography Recording2020/02/013
CPU Overclocking: A Performance Assessment of Air, Cold Plates, and Two-Phase Immersion Cooling2021/10/013
3-D-Printing and High-Precision Milling of W-Band Filter Components With Admittance Inverter Sequences2021/12/013