Electrical conductivity and thermopower of Cu–SiO2 nanogranular films

Article Properties
  • Language
    English
  • DOI (url)
  • Publication Date
    2002/07/15
  • Indian UGC (Journal)
  • Refrences
    13
  • Citations
    11
  • W. Chen Department of Physics, University of Michigan, Ann Arbor, Michigan 48109
  • J. J. Lin Institute of Physics, National Chiao Tung University, Hsinchu 300, Taiwan, Republic of China
  • X. X. Zhang Department of Physics, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, China
  • H. K. Shin Department of Molecular Science and Technology, Ajou University, Suwon, Korea 442-749
  • J. S. Dyck Department of Physics, University of Michigan, Ann Arbor, Michigan 48109
  • C. Uher Department of Physics, University of Michigan, Ann Arbor, Michigan 48109
Abstract
Cite
Chen, W., et al. “Electrical Conductivity and Thermopower of Cu–SiO2 Nanogranular Films”. Applied Physics Letters, vol. 81, no. 3, 2002, pp. 523-5, https://doi.org/10.1063/1.1493668.
Chen, W., Lin, J. J., Zhang, X. X., Shin, H. K., Dyck, J. S., & Uher, C. (2002). Electrical conductivity and thermopower of Cu–SiO2 nanogranular films. Applied Physics Letters, 81(3), 523-525. https://doi.org/10.1063/1.1493668
Chen W, Lin JJ, Zhang XX, Shin HK, Dyck JS, Uher C. Electrical conductivity and thermopower of Cu–SiO2 nanogranular films. Applied Physics Letters. 2002;81(3):523-5.
Journal Categories
Science
Chemistry
Physical and theoretical chemistry
Science
Physics
Technology
Chemical technology
Technology
Electrical engineering
Electronics
Nuclear engineering
Materials of engineering and construction
Mechanics of materials
Description

How do nanogranular structures affect electrical conductivity? This research investigates the thermopower (S) and electrical conductivity (σ) in Cux(SiO2)1−x nanogranular films across a temperature range of 2 to 300 K, focusing on how material composition influences electrical transport, and is relevant to the fields of **physics** and **chemistry**. These films represent unique materials with applications in microelectronics and sensing technologies. The study reveals that disorder-enhanced electron-electron interaction effects govern σ behavior at low temperatures. A crossover from σ∝T to σ∝T1/3 temperature dependence is observed as x decreases and the metal-insulator transition is approached. In contrast, S remains small, displays a linear temperature dependence, and is relatively insensitive to changes in x. Ultimately, this research provides valuable insights into the electrical properties of nanogranular films, with important implications for the design and development of advanced electronic materials. Understanding these transport mechanisms is crucial for tailoring the performance of nanogranular films for various applications in sensing, microelectronics, and energy harvesting, while also having relevance to the world of **engineering**.

Published in Applied Physics Letters, this research aligns with the journal's focus on experimental and theoretical developments in condensed matter physics and materials science. By investigating the electrical conductivity and thermopower of nanogranular films, it contributes to the understanding of electron transport in disordered systems. The references demonstrate engagement with relevant research in solid-state physics, thin-film physics, and materials characterization.

Refrences
Refrences Analysis
The category Science: Physics 14 is the most frequently represented among the references in this article. It primarily includes studies from Journal of Applied Physics The chart below illustrates the number of referenced publications per year.
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Citations
Citations Analysis
The first research to cite this article was titled Effect of electron-phonon interaction on the resistivity of metallic nanowires and was published in 2003. The most recent citation comes from a 2022 study titled Effect of electron-phonon interaction on the resistivity of metallic nanowires . This article reached its peak citation in 2008 , with 3 citations.It has been cited in 10 different journals, 30% of which are open access. Among related journals, the Journal of Alloys and Compounds cited this research the most, with 2 citations. The chart below illustrates the annual citation trends for this article.
Citations used this article by year