IEEE Transactions on Advanced Packaging

Title Publication Date Language Citations
An Integrated Signal and Power Integrity Analysis for Signal Traces Through the Parallel Planes Using Hybrid Finite-Element and Finite-Difference Time-Domain Techniques2007/08/01
Direct Encapsulation of Organic Light-Emitting Devices (OLEDs) Using Photo-Curable co-Polyacrylate/Silica Nanocomposite Resin2007/08/01
Preparation of Fine Copper Powder With Chemical Reduction Method and Its Application in MLCC2007/08/01
Measurement of Moisture-Induced Packaging Stress With Piezoresistive Sensors2007/08/01
A Study of Parylene C Polymer Deposition Inside Microscale Gaps2007/11/01
Model Order Reduction With Parametric Port Formulation2007/11/01
List of reviewers2007/11/01
An Analytical Elasto-Creep Model of Solder Joints in Leadless Chip Resistors: Part 1—Development and Verification2007/11/01
A Novel Bonding Method for Ionic Wafers2007/11/01
An Analytical Elasto-Creep Model of Solder Joints in Leadless Chip Resistors: Part 2—Applications in Fatigue Reliability Predictions for SnPb and Lead-Free Solders2007/11/01
Thermal Management of Biomaterials in a Rectangular Cavity Surrounded by a Phase Change Material2007/11/01
Suppression of EMI and Electromagnetic Noise in Packages Using Embedded Capacitance and Miniaturized Electromagnetic Bandgap Structures With High-k Dielectrics2007/11/01
Prestressed Ceramic Coatings for Enhanced Reliability of Silicon Wafer Fracture Strength2007/11/01
High-Density Solder Bump Interconnect for MEMS Hybrid Integration2007/11/01
Electrical and Thermal Cosimulation of GaAs Interconnects2007/11/01
Design, Modeling, and Characterization of Embedded Capacitor Networks for Core Decoupling in the Package2007/11/01
Smart 3-D Finite-Element Modeling for the Design of Ultra-Low On-Resistance MOSFET2007/11/01
IEEE Components, Packaging, and Manufacturing Technology Society Information2007/11/01
Effect of Gold Stud Bump Topology on Reliability of Flip Chip on Flex Interconnects2007/11/01
A Novel Wafer-Level Hermetic Packaging for MEMS Devices2007/11/01
Electromagnetic-Thermal Characterization of on On-Chip Coupled (A)Symmetrical Interconnects2007/11/01
Passive Order Reduction for RLC Circuits With Delay Elements2007/11/01
Fabrication of Precise Die Edges for Micro-Optical and MEMS Applications2007/11/01
Quilt Packaging: High-Density, High-Speed Interchip Communications2007/11/01
IEEE Components, Packaging, and Manufacturing Technology Society Information for authors2004/05/01
IEEE Components, Packaging, and Manufacturing Technology Society Information2004/05/01
A Fast Computation Method in Frequency Domain for Power Ground Plane Impedance Calculation Using the Mobius Transform2008/05/01
Improvements in Noise Suppression for I/O Circuits Using Embedded Planar Capacitors2008/05/01
40-Gb/s Package Design Using Wire-Bonded Plastic Ball Grid Array2008/05/01
Heat driven cooling of portable electronics using thermoelectric technology2008/05/01