IEEE Transactions on Advanced Packaging

Title Publication Date Language Citations
Enhanced Cu/LCP adhesion by pre-sputter cleaning prior to Cu deposition2005/08/01
Toward a more robust and accurate CEM fast Integral equation solver for IC applications2005/08/01
A Fully Embedded LTCC Multilayer BPF for 3-D Integration of 40-GHz Radio2007/08/01
Design and Fabrication of Ultra-Wideband Baluns Embedded in Multilayer Liquid Crystal Polymer Flex2007/08/01
IEEE Components, Packaging, and Manufacturing Technology Society Information for authors2007/08/01
Algorithmic Approach for Thermal Port Definition2007/08/01
Multichip Integration on a PLC Platform for 16$\,\times\,$16 Optical Switch Module Using Passive Alignment Technique2007/08/01
Table of contents2007/08/01
Electron Attachment: A New Approach to ${\rm H} _{2}$ Fluxless Solder Reflow for Wafer Bumping2007/08/01
Multidisciplinary Electronic Package Design and Optimization Methodology Based on Genetic Algorithm2007/08/01
IEEE Components, Packaging, and Manufacturing Technology Society Information2007/08/01
WIAD Minimization in Butterfly Laser Module Packages: Clip Design2007/08/01
Dramatic Improvements in the Matrix Solution Time for Method of Moment Problems Involving Stripline Interconnects2007/08/01
A Study on Dielectric Constants of ${\rm Epoxy/SrTiO}_{3}$ Composite for Embedded Capacitor Films (ECFs)2007/08/01
A Novel Design Structure for WLCSP With High Reliability, Low Cost, and Ease of Fabrication2007/08/01
Viscoelastic Effect of FR-4 Material on Packaging Stress Development2007/08/01
Numerical Study of Gold Wire Bonding Process on Cu/Low-k Structures2007/08/01
Table of contents2007/08/01
Quality without compromise [advertisement]2007/08/01
Leading the field since 1884 [advertisement]2007/08/01
Table of contents2007/08/01
Integration of 0/1-Level Packaged RF-MEMS Devices on MCM-D at Millimeter-Wave Frequencies2007/08/01
IEEE Transactions on Advanced Packaging publication information2007/08/01
A Novel Test Strategy for Fine Pitch Wafer-Level Packaged Devices2007/08/01
Behavior of Short Pulses on Tightly Coupled Microstrip Lines and Reduction of Crosstalk by Using Overlying Dielectric2007/08/01
Experimental Analysis of the Water Absorption Effects on RF/mm-Wave Active/Passive Circuits Packaged in Multilayer Organic Substrates2007/08/01
Foreword Wafer-Level Packaging2007/08/01
Metal–Polymer Composite Interconnections for Ultra Fine-Pitch Wafer Level Packaging2007/08/01
Characterization of Co-Planar Silicon Transmission Lines With and Without Slow-Wave Effect2007/08/01
A Compact and Low-Radiation CPW Probe Pad Using CBCPW-to-Microstrip Transitions for V-Band LTCC Applications2007/08/01