IEEE Transactions on Advanced Packaging

Title Publication Date Language Citations
On Ultra-Fine Leak Detection of Hermetic Wafer Level Packages2008/02/01
150-$\mu{\rm m}$ Pitch Cu/Low-${\rm k}$ Flip Chip Packaging With Polymer Encapsulated Dicing Line (PEDL) and Cu Column Interconnects2008/02/01
Measurement of Surface Tension of Epoxy Resins Used in Dispensing Process for Manufacturing Thin Film Transistor-Liquid Crystal Displays2008/02/01
Surface Finish Effects on High-Speed Signal Degradation2008/02/01
Influence of Intermetallic Properties on Reliability of Lead-Free Flip-Chip Solder Joints2008/02/01
Table of contents2008/02/01
Integrating Through-Wafer Interconnects With Active Devices and Circuits2008/02/01
Leading the field since 1884 [advertisement]2008/02/01
Efficient Full-Wave Characterization of Discrete High-Density Multiterminal Decoupling Capacitors for High-Speed Digital Systems2008/02/01
High-Speed Flex-Circuit Chip-to-Chip Interconnects2008/02/01
Table of contents2008/02/01
Correction to "A Hybrid Evolutionary Modeling/Optimization Technique for Collector-Up/Down HBTs in RFIC and OEIC Modules"2008/02/01
Order form for reprints2008/02/01
IEEE Components, Packaging, and Manufacturing Technology Society Information for authors2008/02/01
Analyzing the Value of Using Three-Dimensional Electronics for a High-Performance Computational System2008/02/01
Mechanically Flexible Chip-to-Substrate Optical Interconnections Using Optical Pillars2008/01/01
Advanced Packaging: The Redistributed Chip Package2008/02/01
Table of contents2008/02/01
Development of 3-D Stack Package Using Silicon Interposer for High-Power Application2008/01/01
Interfacial Fracture Investigation of Low-k Packaging Using J-Integral Methodology2008/02/01
Evaluation on Influencing Factors of Board-Level Drop Reliability for Chip Scale Packages (Fine-Pitch Ball Grid Array)2008/02/01
Passive Closed-Form Transmission Line Macromodel Using Method of Characteristics2008/02/01
A Random Trimming Approach for Obtaining High-Precision Embedded Resistors2008/02/01
System-on-Packaging with Electroabsorption Modulator for a 60-GHz Band Radio-Over-Fiber Link2008/02/01
IEEE Transactions on Advanced Packaging publication information2008/02/01
Design and Analysis of Shock-Absorbing Structure for Flat Panel Display2008/02/01
Structural Modal Analysis for Detecting Open Solder Bumps on Flip Chips2008/02/01
Low-K Dielectric Compatible Wafer-Level Compliant Chip-to-Substrate Interconnects2008/02/01
A Hybrid ADI and SBTD Scheme for Unconditionally Stable Time-Domain Solutions of Maxwell's Equations2008/02/01
A Complete Finite-Element Analysis of Multilayer Anisotropic Transmission Lines From DC to Terahertz Frequencies2008/05/01