IEEE Transactions on Components, Packaging and Manufacturing Technology

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Journal Properties
  • Formerly known as
    IEEE Transactions on Components and Packaging Technologies, IEEE Transactions on Advanced Packaging, IEEE Transactions on Electronics Packaging Manufacturing
  • Country
    United States
  • Language
    English
  • Number of Articles
    4,236
  • Abbreviation
    IEEE Trans Compon Packag Manuf Technol
  • ISSN
    2156-3950
  • e-ISSN
    2156-3985
  • Main Publisher
    IEEE
  • Publisher
    Institute of Electrical and Electronics Engineers (IEEE)
  • Indian UGC
  • DOAJ (latest)
Journal Properties
  • Science
    Chemistry
    Technology
    Electrical engineering
    Electronics
    Nuclear engineering
    Electric apparatus and materials
    Electric circuits
    Electric networks
    Technology
    Electrical engineering
    Electronics
    Nuclear engineering
    Electronics
    Technology
    Electrical engineering
    Electronics
    Nuclear engineering
    Materials of engineering and construction
    Mechanics of materials
    Technology
    Engineering (General)
    Civil engineering (General)
    Technology
    Manufactures
  • website
Description
IEEE Transactions on Components, Packaging and Manufacturing Technology presents groundbreaking research and advancements in the design, development, and manufacturing of electronic components, packaging, and systems. It serves as a vital resource for engineers, researchers, and professionals focused on optimizing the integration and performance of electronic devices. Its broad scope encompasses microelectronics, optoelectronics, power electronics, and related fields. Key areas covered include advanced packaging techniques, materials science, thermal management, reliability testing, and manufacturing processes. The journal features original research articles, reviews, and tutorial papers that address the challenges and opportunities in creating high-performance, cost-effective electronic systems. Indexed in databases like Web of Science and Scopus. The journal provides a platform for sharing innovative solutions, improving system performance, and advancing manufacturing capabilities. Consider submitting your work and contributing to the ongoing evolution of electronic technology.