IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C focuses on advancements in electronic packaging, components, and manufacturing processes. It's a forum for research and development in microelectronics, optoelectronics, power electronics, and related fields.
The journal addresses novel materials, design methodologies, fabrication techniques, assembly processes, and reliability studies. Topics include: advanced packaging technologies (3D integration, wafer-level packaging), thermal management, high-frequency and high-speed interconnects, and emerging materials. It covers areas such as: modeling, simulation, and characterization techniques applicable to components, packaging, and manufacturing technology. The target audience includes engineers, scientists, and researchers from academia and industry working to enhance the performance and miniaturization of electronic systems. Indexing ensures that the research reaches a global audience.
Consider submitting your research to this esteemed IEEE transaction and contribute to the progression of modern electronics through its submission process. The journal fosters interdisciplinary collaboration and propels development in components, packaging, and manufacturing technology for a range of applications.