透明刚体非侵入式三维重建技术研究进展

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Pan Chifai 潘智辉, et al. “透明刚体非侵入式三维重建技术研究进展”. Laser &Amp; Optoelectronics Progress, vol. 60, no. 8, 2023, p. 0811004, https://doi.org/10.3788/lop223415.
Pan Chifai 潘., Chen Rui 陈., Hu Changping 胡., & Xu Jing 徐. (2023). 透明刚体非侵入式三维重建技术研究进展. Laser &Amp; Optoelectronics Progress, 60(8), 0811004. https://doi.org/10.3788/lop223415
Pan Chifai 潘智辉, Chen Rui 陈睿, Hu Changping 胡昌平, and Xu Jing 徐静. “透明刚体非侵入式三维重建技术研究进展”. Laser &Amp; Optoelectronics Progress 60, no. 8 (2023): 0811004. https://doi.org/10.3788/lop223415.
Pan Chifai 潘, Chen Rui 陈, Hu Changping 胡, Xu Jing 徐. 透明刚体非侵入式三维重建技术研究进展. Laser & Optoelectronics Progress. 2023;60(8):0811004.
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NeRF

 Communications of the ACM
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  • Science: Mathematics: Instruments and machines: Electronic computers. Computer science: Computer software
  • Science: Mathematics: Instruments and machines: Electronic computers. Computer science
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  • Science: Mathematics: Instruments and machines: Electronic computers. Computer science: Computer software
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  • Technology: Electrical engineering. Electronics. Nuclear engineering: Electronics: Computer engineering. Computer hardware
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