Reaction-Diffusion in the Cu–Sn System
Article Properties
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LanguageEnglish
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DOI (url)
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Publication Date1975/01/01
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Indian UGC (journal)
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Refrences25
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Citations207
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Masami Onishi Department of Metallurgy, The Kyushu Institute of Technology
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Hideo Fujibuchi Graduate School, The Kyushu Institute of Technology
Refrences
| Title | Journal | Journal Categories | Citations | Publication Date |
|---|---|---|---|---|
| Diffusion layer growth in a binary system | Journal of Nuclear Materials |
| 27 | 1966 |
| Zur Berechnung von Diffusionskoeffizienten bei ein- und mehrphasiger Diffusion in festen Legierungen | Zeitschrift für Physikalische Chemie |
| 77 | 1952 |
| Interdiffusion and reaction in bimetallic Cu-Sn thin films | Acta Metallurgica | 371 | 1973 | |
| Kirkendall effect studies in copper-tin diffusion couples | Scripta Metallurgica | 30 | 1972 | |
| Diffusion Formation of Intermetallic Compounds in Au-Al Couples by Use of Evapolated Al Films | Journal of the Japan Institute of Metals and Materials |
| 6 | 1974 |
Citations
| Title | Journal | Journal Categories | Citations | Publication Date |
|---|---|---|---|---|
| Self-Healing of Kirkendall Voids and IMC Growth in the Interfacial Reaction of Novel Ni/Cu bi-layer Barrier and Solder | Electronic Materials Letters |
| 2024 | |
| Solid/solid state interfacial reactions in the lead-free solders/Cu- 2.3%wt. Fe alloy (C194) couples | Journal of the Taiwan Institute of Chemical Engineers |
| 2024 | |
| Effects of electrodeposited Co–W and Co–Fe–W diffusion barrier layers on the evolution of Sn/Cu interface | Materials Chemistry and Physics |
| 2024 | |
Nucleation and Location of Kirkendall Voids at the Tin‐Based Solder/Copper Joint: A Review | Advanced Engineering Materials |
| 2 | 2023 |
| Diffusion barrier property of Co-W layer compared with Ni layer in fine pitch micro-bumps during high temperature storage | Materials Letters |
| 3 | 2023 |
Citations Analysis
The category
Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials 157
is the most commonly referenced area in studies that cite this article. The first research to cite this article was titled Studies on superconducting Nb3Sn formed from high-tin-concentration Cu-Sn alloy and was published in 1978. The most recent citation comes from a 2024 study titled Self-Healing of Kirkendall Voids and IMC Growth in the Interfacial Reaction of Novel Ni/Cu bi-layer Barrier and Solder. This article reached its peak citation in 2009, with 14 citations. It has been cited in 62 different journals, 3% of which are open access. Among related journals, the Journal of Electronic Materials cited this research the most, with 32 citations. The chart below illustrates the annual citation trends for this article.