A Review of Hydrophilic Silicon Wafer Bonding

Article Properties
Journal Categories
Science
Chemistry
Science
Physics
Technology
Chemical technology
Technology
Electrical engineering
Electronics
Nuclear engineering
Materials of engineering and construction
Mechanics of materials
Citations
Title Journal Journal Categories Citations Publication Date
An adjustable Ar ion-beam activation strategy to achieve hydrophilic bonding of Si and diamond by deposited AlN interlayer Applied Surface Science
  • Science: Chemistry: Physical and theoretical chemistry
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials
  • Science: Physics
  • Science: Physics
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials
  • Technology: Chemical technology
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials
2024
Nanostructuring, fractal characterization and wettability of ion irradiated Au thin films and their thickness effect Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms
  • Science: Mathematics: Instruments and machines
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Nuclear engineering. Atomic power
  • Science: Physics: Atomic physics. Constitution and properties of matter
  • Science: Physics: Nuclear and particle physics. Atomic energy. Radioactivity
  • Science: Chemistry: Analytical chemistry
  • Science: Physics
2024
Room temperature wafer bonding through conversion of polysilazane into $$\hbox {SiO}_{2}$$

Scientific Reports
  • Medicine
  • Science
  • Science: Science (General)
2024
Heterogeneous integrated InP/SiC high-performance multilevel RRAM

Applied Physics Letters
  • Science: Chemistry: Physical and theoretical chemistry
  • Science: Physics
  • Technology: Chemical technology
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials
  • Science: Physics
2024
Role of humidity and surface roughness on direct wafer bonding

The European Physical Journal B
  • Technology: Chemical technology
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials
  • Science: Physics
  • Science: Physics
2024
Citations Analysis
Category Category Repetition
Technology: Chemical technology44
Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials42
Science: Physics41
Science: Chemistry31
Science: Chemistry: Physical and theoretical chemistry28
Science: Chemistry: General. Including alchemy9
Technology: Electrical engineering. Electronics. Nuclear engineering: Electric apparatus and materials. Electric circuits. Electric networks7
Science: Mathematics: Instruments and machines6
Science: Chemistry: Analytical chemistry5
Technology: Engineering (General). Civil engineering (General)5
Technology: Mechanical engineering and machinery5
Technology: Chemical technology: Polymers and polymer manufacture3
Science: Science (General)3
Technology: Engineering (General). Civil engineering (General): Mechanics of engineering. Applied mechanics3
Technology: Mining engineering. Metallurgy3
Science: Physics: Optics. Light3
Social Sciences: Industries. Land use. Labor: Special industries and trades: Energy industries. Energy policy. Fuel trade2
Medicine2
Science2
Technology: Electrical engineering. Electronics. Nuclear engineering: Electronics2
Technology: Engineering (General). Civil engineering (General): Environmental engineering1
Geography. Anthropology. Recreation: Environmental sciences1
Technology: Environmental technology. Sanitary engineering1
Science: Biology (General): Ecology1
Technology: Electrical engineering. Electronics. Nuclear engineering: Nuclear engineering. Atomic power1
Science: Physics: Atomic physics. Constitution and properties of matter1
Science: Physics: Nuclear and particle physics. Atomic energy. Radioactivity1
Technology: Chemical technology: Chemical engineering1
Technology: Chemical technology: Clay industries. Ceramics. Glass1
Technology: Engineering (General). Civil engineering (General): Applied optics. Photonics1
The category Technology: Chemical technology 44 is the most commonly referenced area in studies that cite this article. The first research to cite this article was titled Adsorption and Self-Assembly of M13 Phage into Directionally Organized Structures on C and SiO2 Films and was published in 2014. The most recent citation comes from a 2024 study titled Nanostructuring, fractal characterization and wettability of ion irradiated Au thin films and their thickness effect. This article reached its peak citation in 2020, with 10 citations. It has been cited in 53 different journals, 9% of which are open access. Among related journals, the Japanese Journal of Applied Physics cited this research the most, with 9 citations. The chart below illustrates the annual citation trends for this article.
Citations used this article by year