Electromagnetic Pulse Induced Failure Analysis of GaN HEMT Based Power Amplifier

Article Properties
  • Publication Date
    2024/01/01
  • Indian UGC (journal)
  • Refrences
    37
  • Lei Wang Key Laboratory of the Ministry of Education for Wide Band-Gap Semiconductor Materials and Devices, School of Microelectronics, Xidian University, Xi'an, China
  • Changchun Chai Key Laboratory of the Ministry of Education for Wide Band-Gap Semiconductor Materials and Devices, School of Microelectronics, Xidian University, Xi'an, China
  • Tian-Long Zhao Key Laboratory of the Ministry of Education for Wide Band-Gap Semiconductor Materials and Devices, School of Microelectronics, Xidian University, Xi'an, China ORCID (unauthenticated)
  • Feng Wei School of Electrical Engineering, Xidian University, Xi'an, China ORCID (unauthenticated)
  • Wei-Shen Liu School of Electrical Engineering, Xidian University, Xi'an, China
  • Yutian Wang Key Laboratory of the Ministry of Education for Wide Band-Gap Semiconductor Materials and Devices, School of Microelectronics, Xidian University, Xi'an, China
  • Zhao Li School of Electrical Engineering, Xidian University, Xi'an, China
  • Le Xu School of Electrical Engineering, Xidian University, Xi'an, China ORCID (unauthenticated)
  • Fuxing Li Key Laboratory of the Ministry of Education for Wide Band-Gap Semiconductor Materials and Devices, School of Microelectronics, Xidian University, Xi'an, China
  • Yintang Yang Key Laboratory of the Ministry of Education for Wide Band-Gap Semiconductor Materials and Devices, School of Microelectronics, Xidian University, Xi'an, China
Journal Categories
Technology
Electrical engineering
Electronics
Nuclear engineering
Electric apparatus and materials
Electric circuits
Electric networks
Technology
Electrical engineering
Electronics
Nuclear engineering
Electronics
Refrences
Title Journal Journal Categories Citations Publication Date
Development of GaN HEMT for microwave wireless communications 2012
10.1109/GAAS.2002.1049035
10.1109/TPEL.2020.3026328
10.1109/JESTPE.2018.2873156
10.1109/TIE.2017.2681968