HyunjinKim Department of Electrical and Computer Engineering, Institute of New Media and Communications (INMC), Seoul National University, Seoul, South Korea ORCID (unauthenticated)
JungsuekOh Department of Electrical and Computer Engineering, Institute of New Media and Communications (INMC), Seoul National University, Seoul, South Korea ORCID (unauthenticated)
Cite
Kim, Hyunjin, and Jungsuek Oh. “D-Band Stripline Interconnection Using Capped Cavity via Transition”. IEEE Microwave and Wireless Technology Letters, vol. 33, no. 9, 2023, pp. 1262-5, https://doi.org/10.1109/lmwt.2023.3285883.
Kim, H., & Oh, J. (2023). D-Band Stripline Interconnection Using Capped Cavity via Transition. IEEE Microwave and Wireless Technology Letters, 33(9), 1262-1265. https://doi.org/10.1109/lmwt.2023.3285883
Kim H, Oh J. D-Band Stripline Interconnection Using Capped Cavity via Transition. IEEE Microwave and Wireless Technology Letters. 2023;33(9):1262-5.