High Inductance Density Glass Embedded Inductors for 3-D Integration

Article Properties

• DOI (url)

  10.1109/lmwt.2023.3248146
• Publication Date

  2023/06/01
• Journal

  IEEE Microwave and Wireless Technology Letters
• Indian UGC (journal)
• Refrences

  23
• Citations

  1
• Guanyu Zhou State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu, China ORCID (unauthenticated)
• Libin Gao State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu, China
• Yuzhe Chen State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu, China
• Hongwei Chen State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu, China
• Wenlei Li State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu, China ORCID (unauthenticated)
• Chao Zhang State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu, China
• Jinxu Liu State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu, China
• Jihua Zhang State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu, China