RF Glass Technology Is Going Mainstream: Review and Future Applications

Article Properties
Cite
Chaloun, Tobias, et al. “RF Glass Technology Is Going Mainstream: Review and Future Applications”. IEEE Journal of Microwaves, vol. 3, no. 2, 2023, pp. 783-99, https://doi.org/10.1109/jmw.2023.3256413.
Chaloun, T., Brandl, S., Ambrosius, N., Kröhnert, K., Maune, H., & Waldschmidt, C. (2023). RF Glass Technology Is Going Mainstream: Review and Future Applications. IEEE Journal of Microwaves, 3(2), 783-799. https://doi.org/10.1109/jmw.2023.3256413
Chaloun T, Brandl S, Ambrosius N, Kröhnert K, Maune H, Waldschmidt C. RF Glass Technology Is Going Mainstream: Review and Future Applications. IEEE Journal of Microwaves. 2023;3(2):783-99.
Journal Categories
Technology
Electrical engineering
Electronics
Nuclear engineering
Electric apparatus and materials
Electric circuits
Electric networks
Technology
Electrical engineering
Electronics
Nuclear engineering
Telecommunication
Refrences
Title Journal Journal Categories Citations Publication Date
High-throughput via formation in solid-core glass for IC substrates
High aspect ratio through-glass vias as heat conductive element
Development of through glass via technology for 3D packaging
Recent progress in electronically tunable reflectarray technology using liquid crystals
Signal transmission loss due to copper surface roughness in high-frequency region 2014
Citations
Title Journal Journal Categories Citations Publication Date
Heterogeneous Integration of Diamond-on-Chip-on-Glass Interposer for Efficient Thermal Management IEEE Electron Device Letters
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Electronics
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Electric apparatus and materials. Electric circuits. Electric networks
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Electronics
2024
Citations Analysis
The category Technology: Electrical engineering. Electronics. Nuclear engineering: Electronics 1 is the most commonly referenced area in studies that cite this article.