Title | Journal | Journal Categories | Citations | Publication Date |
---|---|---|---|---|
High-throughput via formation in solid-core glass for IC substrates | ||||
High aspect ratio through-glass vias as heat conductive element | ||||
Development of through glass via technology for 3D packaging | ||||
Recent progress in electronically tunable reflectarray technology using liquid crystals | ||||
Signal transmission loss due to copper surface roughness in high-frequency region | 2014 |
Title | Journal | Journal Categories | Citations | Publication Date |
---|---|---|---|---|
Heterogeneous Integration of Diamond-on-Chip-on-Glass Interposer for Efficient Thermal Management | IEEE Electron Device Letters |
| 2024 |