Equivalent Elmore delay for RLC trees

Article Properties
Journal Categories
Science
Mathematics
Instruments and machines
Electronic computers
Computer science
Technology
Electrical engineering
Electronics
Nuclear engineering
Electric apparatus and materials
Electric circuits
Electric networks
Technology
Electrical engineering
Electronics
Nuclear engineering
Electronics
Technology
Electrical engineering
Electronics
Nuclear engineering
Electronics
Computer engineering
Computer hardware
Technology
Engineering (General)
Civil engineering (General)
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Refrences
Title Journal Journal Categories Citations Publication Date
When are transmission-line effects important for on-chip interconnections? IEEE Transactions on Microwave Theory and Techniques
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Electronics
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Electric apparatus and materials. Electric circuits. Electric networks
 117 1997
Figures of merit to characterize the importance of on-chip inductance 1998
rc interconnect optimization under the elmore delay model 1994
rectilinear steiner trees with minimum elmore delay 1994
high-performance routing trees with identified critical sinks 1993
Citations
Title Journal Journal Categories Citations Publication Date
Fully Microstrip Three-Port Circuit Bandpass NGD Design and Test IEEE Design & Test
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Electronics: Computer engineering. Computer hardware
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Electric apparatus and materials. Electric circuits. Electric networks
  • Science: Mathematics: Instruments and machines: Electronic computers. Computer science: Computer software
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Electronics: Computer engineering. Computer hardware
  • Science: Mathematics: Instruments and machines: Electronic computers. Computer science
 2023
An Analytic RLC Model for Coupled Interconnects Which Uses a Numerical Inverse Laplace Transform IEEE Transactions on Very Large Scale Integration (VLSI) Systems
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Electronics: Computer engineering. Computer hardware
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Electric apparatus and materials. Electric circuits. Electric networks
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Electronics
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Electronics
  • Technology: Engineering (General). Civil engineering (General)
 2023
An innovative interconnect structure with improved Elmore delay estimation model for deep submicron technology Analog Integrated Circuits and Signal Processing
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Electronics: Computer engineering. Computer hardware
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Electric apparatus and materials. Electric circuits. Electric networks
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Electronics
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Electronics
  • Technology: Engineering (General). Civil engineering (General)
 2 2022
Crosstalk noise analysis of coupled on-chip interconnects using a multiresolution time domain (MRTD) technique Journal of Computational Electronics
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Electric apparatus and materials. Electric circuits. Electric networks
  • Science: Physics
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Electronics
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Electronics
 2022
Novel Tee-Shaped Topology Theory of Low- and High-Pass NGD Double-Type Function IEEE Access
  • Technology: Electrical engineering. Electronics. Nuclear engineering
  • Science: Science (General): Cybernetics: Information theory
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Electric apparatus and materials. Electric circuits. Electric networks
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Telecommunication
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Electronics
  • Technology: Electrical engineering. Electronics. Nuclear engineering: Electronics
 2022
Citations Analysis
Category Category Repetition
Technology: Electrical engineering. Electronics. Nuclear engineering: Electric apparatus and materials. Electric circuits. Electric networks56
Technology: Electrical engineering. Electronics. Nuclear engineering: Electronics53
Technology: Engineering (General). Civil engineering (General)40
Technology: Electrical engineering. Electronics. Nuclear engineering: Electronics: Computer engineering. Computer hardware35
Science: Mathematics: Instruments and machines: Electronic computers. Computer science18
Science: Physics11
Technology: Chemical technology8
Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials5
Science: Mathematics: Instruments and machines: Electronic computers. Computer science: Computer software5
Science: Science (General): Cybernetics: Information theory4
Technology: Electrical engineering. Electronics. Nuclear engineering: Telecommunication4
Technology: Electrical engineering. Electronics. Nuclear engineering2
Science: Physics: Optics. Light2
Technology: Manufactures: Production management. Operations management2
Science: Mathematics2
Science: Chemistry: Physical and theoretical chemistry1
Social Sciences: Commerce: Business: Personnel management. Employment management1
The category Technology: Electrical engineering. Electronics. Nuclear engineering: Electric apparatus and materials. Electric circuits. Electric networks 56 is the most commonly referenced area in studies that cite this article. The first research to cite this article was titled Parasitic extraction: current state of the art and future trends and was published in 2001. The most recent citation comes from a 2023 study titled An Analytic RLC Model for Coupled Interconnects Which Uses a Numerical Inverse Laplace Transform. This article reached its peak citation in 2005, with 8 citations. It has been cited in 42 different journals, 7% of which are open access. Among related journals, the IEEE Transactions on Very Large Scale Integration (VLSI) Systems cited this research the most, with 13 citations. The chart below illustrates the annual citation trends for this article.
Citations used this article by year