Metal-containing thin-film encapsulation with flexibility and heat transfer
Article Properties
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LanguageEnglish
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DOI (url)
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Publication Date2015/04/03
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Journal
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Indian UGC (journal)
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Refrences19
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Citations17
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Jeong Hyun Kwon
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Eungtaek Kim
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Hyeon-Gyun Im
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Byeong-Soo Bae
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Ki Soo Chang
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Sang-Hee Ko Park
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Kyung Cheol Choi
Cite
Kwon, Jeong Hyun, et al. “Metal-Containing Thin-Film Encapsulation With Flexibility and Heat Transfer”. Journal of Information Display, vol. 16, no. 2, 2015, pp. 123-8, https://doi.org/10.1080/15980316.2015.1046959.
Kwon, J. H., Kim, E., Im, H.-G., Bae, B.-S., Chang, K. S., Ko Park, S.-H., & Choi, K. C. (2015). Metal-containing thin-film encapsulation with flexibility and heat transfer. Journal of Information Display, 16(2), 123-128. https://doi.org/10.1080/15980316.2015.1046959
Kwon JH, Kim E, Im HG, Bae BS, Chang KS, Ko Park SH, et al. Metal-containing thin-film encapsulation with flexibility and heat transfer. Journal of Information Display. 2015;16(2):123-8.
Journal Categories
Science
Chemistry
Technology
Electrical engineering
Electronics
Nuclear engineering
Electronics
Computer engineering
Computer hardware
Technology
Electrical engineering
Electronics
Nuclear engineering
Materials of engineering and construction
Mechanics of materials
Refrences
| Title | Journal | Journal Categories | Citations | Publication Date |
|---|---|---|---|---|
Conductivity mechanism of nanosized silver layer embedded in indium zinc oxide | Journal of Applied Physics |
| 9 | 2012 |
Transparent Barrier Coatings Update: Flexible Substrates | Journal of Plastic Film & Sheeting |
| 14 | 1993 |
Permeation rate measurements by electrical analysis of calcium corrosion | Review of Scientific Instruments |
| 188 | 2003 |
| Silica nanoparticle-embedded sol–gel organic/inorganic hybrid nanocomposite for transparent OLED encapsulation | Organic Electronics |
| 69 | 2012 |
| Heat transfer property of thin-film encapsulation for OLEDs | Organic Electronics |
| 42 | 2011 |
Citations
| Title | Journal | Journal Categories | Citations | Publication Date |
|---|---|---|---|---|
| A highly bendable thin film encapsulation by the modulation of thermally induced interfacial residual stress | Applied Surface Science |
| 5 | 2022 |
| A Highly Bendable Thin Film Encapsulation by the Modulation of Thermally Induced Interfacial Residual Stress | SSRN Electronic Journal | 2022 | ||
A Review of Various Attempts on Multi-Functional Encapsulation Technologies for the Reliability of OLEDs | Micromachines |
| 13 | 2022 |
| Reliable high temperature, high humidity flexible thin film encapsulation using Al2O3/MgO nanolaminates for flexible OLEDs | Nano Research |
| 28 | 2020 |
| Class-II-type nanosilica-epoxy hybrid coating with high moisture barrier performance and mechanical robustness | Progress in Organic Coatings |
| 10 | 2019 |
Citations Analysis
The category
Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials 13
is the most commonly referenced area in studies that cite this article. The first research to cite this article was titled P-96: Heat Transferable Thin Film Encapsulation Inserted Ag Thin Film to Improve Reliability of Flexible Displays and was published in 2016. The most recent citation comes from a 2022 study titled A Review of Various Attempts on Multi-Functional Encapsulation Technologies for the Reliability of OLEDs. This article reached its peak citation in 2018, with 4 citations. It has been cited in 14 different journals, 14% of which are open access. Among related journals, the ACS Applied Materials & Interfaces cited this research the most, with 3 citations. The chart below illustrates the annual citation trends for this article.