A continuum model for dislocation climb
Article Properties
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LanguageEnglish
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DOI (url)
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Publication Date2023/09/01
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Indian UGC (journal)
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Refrences62
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Citations2
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Chutian Huang ORCID (unauthenticated)
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Shuyang Dai
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Xiaohua Niu
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Tianpeng Jiang ORCID (unauthenticated)
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Zhijian Yang
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Yejun Gu ORCID (unauthenticated)
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Yang Xiang
Cite
Huang, Chutian, et al. “A Continuum Model for Dislocation Climb”. International Journal of Plasticity, vol. 168, 2023, p. 103700, https://doi.org/10.1016/j.ijplas.2023.103700.
Huang, C., Dai, S., Niu, X., Jiang, T., Yang, Z., Gu, Y., & Xiang, Y. (2023). A continuum model for dislocation climb. International Journal of Plasticity, 168, 103700. https://doi.org/10.1016/j.ijplas.2023.103700
Huang, Chutian, Shuyang Dai, Xiaohua Niu, Tianpeng Jiang, Zhijian Yang, Yejun Gu, and Yang Xiang. “A Continuum Model for Dislocation Climb”. International Journal of Plasticity 168 (2023): 103700. https://doi.org/10.1016/j.ijplas.2023.103700.
Huang C, Dai S, Niu X, Jiang T, Yang Z, Gu Y, et al. A continuum model for dislocation climb. International Journal of Plasticity. 2023;168:103700.
Journal Categories
Science
Chemistry
Technology
Engineering (General)
Civil engineering (General)
Technology
Engineering (General)
Civil engineering (General)
Mechanics of engineering
Applied mechanics
Technology
Mechanical engineering and machinery
Refrences
| Title | Journal | Journal Categories | Citations | Publication Date |
|---|---|---|---|---|
In situ atomic-scale observation of dislocation climb and grain boundary evolution in nanostructured metal | Nature Communications |
| 22 | 2022 |
The kinetics of static recovery by dislocation climb | npj Computational Materials |
| 18 | 2022 |
| Annihilation and sources in continuum dislocation dynamics | Materials Theory |
| 23 | 2018 |
| Dislocation Creep: Climb and Glide in the Lattice Continuum | Crystals |
| 15 | 2017 |
Mapping strain rate dependence of dislocation-defect interactions by atomistic simulations | Proceedings of the National Academy of Sciences |
| 91 | 2013 |
Refrences Analysis
The category
Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials 45
is the most frequently represented among the references in this article. It primarily includes studies from Journal of the Mechanics and Physics of Solids and International Journal of Plasticity. The chart below illustrates the number of referenced publications per year.
Refrences used by this article by year
Citations
| Title | Journal | Journal Categories | Citations | Publication Date |
|---|---|---|---|---|
| A computational mechanical constitutive modeling method based on thermally-activated microstructural evolution and strengthening mechanisms | International Journal of Plasticity |
| 2024 | |
| A novel insight into Au-Au thermosonic flip chip joint under extreme thermal cycles: Defect characterization and failure analysis | Surfaces and Interfaces |
| 2024 |
Citations Analysis
The category
Technology: Mechanical engineering and machinery 1
is the most commonly referenced area in studies that cite this article. The first research to cite this article was titled A computational mechanical constitutive modeling method based on thermally-activated microstructural evolution and strengthening mechanisms and was published in 2024. The most recent citation comes from a 2024 study titled A computational mechanical constitutive modeling method based on thermally-activated microstructural evolution and strengthening mechanisms. This article reached its peak citation in 2024, with 2 citations. It has been cited in 2 different journals. Among related journals, the International Journal of Plasticity cited this research the most, with 1 citations. The chart below illustrates the annual citation trends for this article.