Journal of Electronic Materials

Title Publication Date Language Citations
Estimation of the thermal band gap of a semiconductor from seebeck measurements1999/07/01English657
Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys2000/10/01English381
High Thermoelectric Performance of Dually Doped ZnO Ceramics2009/06/02English332
Ultraviolet detectors based on epitaxial ZnO films grown by MOCVD2000/01/01English304
Thermo-mechanical Characterization of Metal/Polymer Composite Filaments and Printing Parameter Study for Fused Deposition Modeling in the 3D Printing Process2014/10/29English293
Thermal behavior of silver nanoparticles for low-temperature interconnect applications2005/02/01English276
Nanostructured thermoelectric materials2005/05/01English263
Automotive Applications of Thermoelectric Materials2009/02/13English257
Theory for intermetallic phase growth between cu and liquid Sn-Pb solder based on grain boundary diffusion control1998/11/01English249
GaN Technology for Power Electronic Applications: A Review2016/03/10English248
Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni2002/06/01English228
Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection2007/09/11English220
Thermoelectric quantum-dot superlattices with high ZT2000/01/01English219
Reactive Sintering of Copper Nanoparticles Using Intense Pulsed Light for Printed Electronics2010/09/30English215
Nickel filament polymer-matrix composites with low surface impedance and high electromagnetic interference shielding effectiveness1997/08/01English196
High-Temperature Capacitor Polymer Films2014/10/15English187
Modifying Poly(Vinyl Alcohol) (PVA) from Insulator to Small-Bandgap Polymer: A Novel Approach for Organic Solar Cells and Optoelectronic Devices2015/11/19English184
MBE HgCdTe Technology: A Very General Solution to IR Detection, Described by “Rule 07”, a Very Convenient Heuristic2008/03/21English179
Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic solders1997/07/01English173
Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?2014/01/17English172
Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging1999/11/01English171
Self-assembly of metal nanocrystals on ultrathin oxide for nonvolatile memory applications2005/01/01English162
Preparation of atomically flat surfaces on silicon carbide using hydrogen etching1998/04/01English161
Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability2001/09/01English159
Electric current effects upon the Sn/Cu and Sn/Ni interfacial reactions1998/11/01English158
Metal contacts to n-type GaN1998/04/01English154
Effects of cooling rate on the microstructure and tensile behavior of a Sn-3.5wt.%Ag solder2003/12/01English150
Studies on Conducting Polypyrrole/Graphene Oxide Composites as Supercapacitor Electrode2011/09/22English137
Sintering of Inkjet-Printed Silver Nanoparticles at Room Temperature Using Intense Pulsed Light2011/08/12English135
Phase equilibria and solidification properties of Sn-Cu-Ni alloys2002/09/01English133