Power Electronic Devices and Components

Title Publication Date Language Citations
The state-of-the-art of power electronics converters configurations in electric vehicle technologies2022/03/01English29
Impact of post-deposition anneal on ALD Al2O3/etched GaN interface for gate-first MOSc-HEMT2023/03/01English6
Printed circuit board embedded power semiconductors: A technology review2022/10/01English6
Advantages of the extended finite element method for the analysis of crack propagation in power modules2023/03/01English4
A self-powered H-Bridge joule theory circuit for piezoelectric energy harvesting systems2022/10/01English4
Performance limits of high voltage press-pack SiC IGBT and SiC MOSFET devices2022/10/01English4
Choice of control function in magnetically-coupled full bridge DC-DC power controller for arc welding: A Practical Approach2022/06/01English4
A detailed study of Qdc of 3D micro air-core inductors for integrated power supplies: Power supply in package (PSiP) and power supply on chip (PSoC)2022/06/01English3
Layer-by-layer printable nano-scale polypropylene for precise control of nanocomposite capacitor dielectric morphologies in metallised film capacitors2023/03/01English3
Comparison of GaN Enhancement Mode Transistor Performance With Integrated and External Driver2022/06/01English3
Growth of p-type GaN – The role of oxygen in activation of Mg-doping2023/06/01English2
Investigation on safe-operating-area degradation and failure modes of SiC MOSFETs under repetitive short-circuit conditions2023/03/01English2
Surface discharge characteristics of silicone gel and DBC under positive repetitive square voltage2022/10/01English2
Switching waveform design with gate charge control for power MOSFETs2022/10/01English2
Maximum Peak Current and Junction-to-ambient Delta-temperature Investigation in GaN FETs Parallel Connection2023/06/01English2
ICeGaNTM technology: The easy-to-use and self-protected GaN power IC2023/03/01English1
Si-IGBT and SiC-MOSFET hybrid switch-based 1.7 kV half-bridge power module2022/10/01English1
Reliability Behavior of A Resin-Free Nanosilver Paste at Ultra-Low Temperature of 180°C2022/10/01English1
Research on Long-term Reliability of Silver Sintered Press-Pack IGBT Modules2022/10/01English1
Projecting GaN HEMTs lifetimes under typical stresses commonly observed in DC-DC converters2023/10/01English1
Life-cycle energy demand comparison of medium voltage Silicon IGBT and Silicon Carbide MOSFET power semiconductor modules in railway traction applications2023/10/01English1
Thick gate oxide extrinsic breakdown – The potential role of neutral hydrogen atom2023/03/01English1
The design considerations of stray inductance for power modules with parallel-connected IGBT chips for a digital gate driver control2023/10/01English1
Optimization of linear cell 4H-SiC power JBSFETs: Impact of N+ source contact resistance2022/06/01English1
Advanced voltage balancing techniques for series-connected SiC-MOSFET devices: A comprehensive survey2024/04/01English
Assembly technology of electronic components for e-textiles2024/04/01English
On short channel effects in high voltage JFETs: A theoretical analysis2024/04/01English
Mechanism of gate voltage spike under digital gate control at IGBT switching operations2024/04/01English
Electromagnetic analysis of switching cells with dies embedded in printed circuit boards: Application to TAPIR (compacT and modulAr Power modules with IntegRated cooling) technology2022/10/01English
MOSFET Selection for a 18ka modular power converter for HL-LHC inner triplet2023/10/01English